Simulation And Performance Studies Of Thermally Efficient Light Emitting Diodes Drivers
The thermal behaviour of an electronic package is often characterized by evaluating the junction temperature and thermal resistance at the junction of a single or multiple heat source to ambient. In the case of IC LED drivers, the heat source within the device is either single or multiple due to...
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| Main Author: | |
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| Format: | Thesis |
| Language: | English |
| Published: |
2018
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| Subjects: | |
| Online Access: | http://eprints.usm.my/61209/1/Simulation%20and%20performance%20studies%20cut.pdf |
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| Summary: | The thermal behaviour of an electronic package is often characterized by
evaluating the junction temperature and thermal resistance at the junction of a single or
multiple heat source to ambient. In the case of IC LED drivers, the heat source within
the device is either single or multiple due to presence of many integrated component
such as transistor, internal resistor, etc on a single die. Hence the evaluation of IC
drivers with single or multiple heat sources is absolutely necessary for imparting
suitable thermal management within the device. In this study, thermal transient
measurement method and computational fluid dynamics (CFD) simulations have been
used to measure thermal resistance and junction temperature. |
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