Simulation And Performance Studies Of Thermally Efficient Light Emitting Diodes Drivers
The thermal behaviour of an electronic package is often characterized by evaluating the junction temperature and thermal resistance at the junction of a single or multiple heat source to ambient. In the case of IC LED drivers, the heat source within the device is either single or multiple due to...
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my-usm-ep.612092024-09-24T07:17:30Z Simulation And Performance Studies Of Thermally Efficient Light Emitting Diodes Drivers 2018-09 Mohd Supian, Norazlina TK7800-8360 Electronics The thermal behaviour of an electronic package is often characterized by evaluating the junction temperature and thermal resistance at the junction of a single or multiple heat source to ambient. In the case of IC LED drivers, the heat source within the device is either single or multiple due to presence of many integrated component such as transistor, internal resistor, etc on a single die. Hence the evaluation of IC drivers with single or multiple heat sources is absolutely necessary for imparting suitable thermal management within the device. In this study, thermal transient measurement method and computational fluid dynamics (CFD) simulations have been used to measure thermal resistance and junction temperature. 2018-09 Thesis http://eprints.usm.my/61209/ http://eprints.usm.my/61209/1/Simulation%20and%20performance%20studies%20cut.pdf application/pdf en public masters Universiti Sains Malaysia Pusat Pengajian Sains Fizik |
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Universiti Sains Malaysia |
| collection |
USM Institutional Repository |
| language |
English |
| topic |
TK7800-8360 Electronics |
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TK7800-8360 Electronics Mohd Supian, Norazlina Simulation And Performance Studies Of Thermally Efficient Light Emitting Diodes Drivers |
| description |
The thermal behaviour of an electronic package is often characterized by
evaluating the junction temperature and thermal resistance at the junction of a single or
multiple heat source to ambient. In the case of IC LED drivers, the heat source within
the device is either single or multiple due to presence of many integrated component
such as transistor, internal resistor, etc on a single die. Hence the evaluation of IC
drivers with single or multiple heat sources is absolutely necessary for imparting
suitable thermal management within the device. In this study, thermal transient
measurement method and computational fluid dynamics (CFD) simulations have been
used to measure thermal resistance and junction temperature. |
| format |
Thesis |
| qualification_level |
Master's degree |
| author |
Mohd Supian, Norazlina |
| author_facet |
Mohd Supian, Norazlina |
| author_sort |
Mohd Supian, Norazlina |
| title |
Simulation And Performance Studies
Of Thermally Efficient Light Emitting
Diodes Drivers |
| title_short |
Simulation And Performance Studies
Of Thermally Efficient Light Emitting
Diodes Drivers |
| title_full |
Simulation And Performance Studies
Of Thermally Efficient Light Emitting
Diodes Drivers |
| title_fullStr |
Simulation And Performance Studies
Of Thermally Efficient Light Emitting
Diodes Drivers |
| title_full_unstemmed |
Simulation And Performance Studies
Of Thermally Efficient Light Emitting
Diodes Drivers |
| title_sort |
simulation and performance studies
of thermally efficient light emitting
diodes drivers |
| granting_institution |
Universiti Sains Malaysia |
| granting_department |
Pusat Pengajian Sains Fizik |
| publishDate |
2018 |
| url |
http://eprints.usm.my/61209/1/Simulation%20and%20performance%20studies%20cut.pdf |
| _version_ |
1811772892543713280 |