Thermal Investigations Of Flip Chip Microelectronic Package With Non-Uniform Power Distribution [TK7874. G614 2004 f rb] [Microfiche 7607].

Thermal Investigations Of Flip Chip Microelectronic Package With Non-Uniform Power Distribution [TK7874. G614 2004 f rb] [Microfiche 7607].

Arah aliran pempakejan sistem-sistem dan subsistem mikroelektronik adalah kearah pengurangan saiz dan peningkatan prestasi, di mana kedua-duanya menyumbang kepada peningkatan kadar penjanaan haba. The trend in packaging microelectronic systems and subsystems has been to reduce size and increase...

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Main Author: Goh, Teck Joo
Format: Thesis
Language:English
Published: 2004
Subjects:
TK7800-8360 Electronics
Online Access:http://eprints.usm.my/6319/1/THERMAL_INVESTIGATIONS_OF_FLIP_CHIP_MICROELECTRONIC_PACKAGE_WITH_NON-UNIFORM_POWER_DISTRIBUTION.pdf
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id my-usm-ep.6319
record_format uketd_dc
spelling my-usm-ep.63192013-07-13T03:25:03Z Thermal Investigations Of Flip Chip Microelectronic Package With Non-Uniform Power Distribution [TK7874. G614 2004 f rb] [Microfiche 7607]. 2004-06 Goh, Teck Joo TK7800-8360 Electronics Arah aliran pempakejan sistem-sistem dan subsistem mikroelektronik adalah kearah pengurangan saiz dan peningkatan prestasi, di mana kedua-duanya menyumbang kepada peningkatan kadar penjanaan haba. The trend in packaging microelectronic systems and subsystems has been to reduce size and increase performance, both of which contribute to increase heat generation. 2004-06 Thesis http://eprints.usm.my/6319/ http://eprints.usm.my/6319/1/THERMAL_INVESTIGATIONS_OF_FLIP_CHIP_MICROELECTRONIC_PACKAGE_WITH_NON-UNIFORM_POWER_DISTRIBUTION.pdf application/pdf en public phd doctoral Universiti Sains Malaysia Pusat Pengajian Kejuruteraan Mekanik
institution Universiti Sains Malaysia
collection USM Institutional Repository
language English
topic TK7800-8360 Electronics
spellingShingle TK7800-8360 Electronics
Goh, Teck Joo
Thermal Investigations Of Flip Chip Microelectronic Package With Non-Uniform Power Distribution [TK7874. G614 2004 f rb] [Microfiche 7607].
description Arah aliran pempakejan sistem-sistem dan subsistem mikroelektronik adalah kearah pengurangan saiz dan peningkatan prestasi, di mana kedua-duanya menyumbang kepada peningkatan kadar penjanaan haba. The trend in packaging microelectronic systems and subsystems has been to reduce size and increase performance, both of which contribute to increase heat generation.
format Thesis
qualification_name Doctor of Philosophy (PhD.)
qualification_level Doctorate
author Goh, Teck Joo
author_facet Goh, Teck Joo
author_sort Goh, Teck Joo
title Thermal Investigations Of Flip Chip Microelectronic Package With Non-Uniform Power Distribution [TK7874. G614 2004 f rb] [Microfiche 7607].
title_short Thermal Investigations Of Flip Chip Microelectronic Package With Non-Uniform Power Distribution [TK7874. G614 2004 f rb] [Microfiche 7607].
title_full Thermal Investigations Of Flip Chip Microelectronic Package With Non-Uniform Power Distribution [TK7874. G614 2004 f rb] [Microfiche 7607].
title_fullStr Thermal Investigations Of Flip Chip Microelectronic Package With Non-Uniform Power Distribution [TK7874. G614 2004 f rb] [Microfiche 7607].
title_full_unstemmed Thermal Investigations Of Flip Chip Microelectronic Package With Non-Uniform Power Distribution [TK7874. G614 2004 f rb] [Microfiche 7607].
title_sort thermal investigations of flip chip microelectronic package with non-uniform power distribution [tk7874. g614 2004 f rb] [microfiche 7607].
granting_institution Universiti Sains Malaysia
granting_department Pusat Pengajian Kejuruteraan Mekanik
publishDate 2004
url http://eprints.usm.my/6319/1/THERMAL_INVESTIGATIONS_OF_FLIP_CHIP_MICROELECTRONIC_PACKAGE_WITH_NON-UNIFORM_POWER_DISTRIBUTION.pdf
_version_ 1747819675949989888

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