APA引文

Abdullah, M. K. (2006). Modelling And Analysis Of Stacked-Chip Scale Packages (S-Csps) Encapsulation Process Using Finite Difference Method [TK7874. K46 2007 f rb].

Chicago Style (17th ed.) Citation

Abdullah, Muhammad Khalil. Modelling And Analysis Of Stacked-Chip Scale Packages (S-Csps) Encapsulation Process Using Finite Difference Method [TK7874. K46 2007 F Rb]. 2006.

MLA引文

Abdullah, Muhammad Khalil. Modelling And Analysis Of Stacked-Chip Scale Packages (S-Csps) Encapsulation Process Using Finite Difference Method [TK7874. K46 2007 F Rb]. 2006.

警告：这些引文格式不一定是100％准确.