Abdullah, M. K. (2006). Modelling And Analysis Of Stacked-Chip Scale Packages (S-Csps) Encapsulation Process Using Finite Difference Method [TK7874. K46 2007 f rb].
Chicago Style (17th ed.) CitationAbdullah, Muhammad Khalil. Modelling And Analysis Of Stacked-Chip Scale Packages (S-Csps) Encapsulation Process Using Finite Difference Method [TK7874. K46 2007 F Rb]. 2006.
MLA (8th ed.) CitationAbdullah, Muhammad Khalil. Modelling And Analysis Of Stacked-Chip Scale Packages (S-Csps) Encapsulation Process Using Finite Difference Method [TK7874. K46 2007 F Rb]. 2006.
Warning: These citations may not always be 100% accurate.