Modelling And Analysis Of Stacked-Chip Scale Packages (S-Csps) Encapsulation Process Using Finite Difference Method [TK7874. K46 2007 f rb].

Pada hari ini, peranti-peranti mikroelektronik menjadi lebih padat, ringan dan mempunyai lebih fungsi, ini termasuklah pakej skala cip-bertingkat (S-CSP). Ia adalah satu teknologi yang memberi opsyen kepadatan pempakejan yang tinggi. Nowadays, microelectronic devices become more compact, lighter...

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Bibliographic Details
Main Author:	Abdullah, Muhammad Khalil
Format:	Thesis
Language:	English
Published:	2006
Subjects:	TK7885-7895 Computer engineering Computer hardware
Online Access:	http://eprints.usm.my/9178/1/NUMERICAL_ALGORITHM_OF_STACKED-CHIP_SCALE_PACKAGES.pdf
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id	my-usm-ep.9178
record_format	uketd_dc
spelling	my-usm-ep.91782017-04-17T09:26:37Z Modelling And Analysis Of Stacked-Chip Scale Packages (S-Csps) Encapsulation Process Using Finite Difference Method [TK7874. K46 2007 f rb]. 2006-06 Abdullah, Muhammad Khalil TK7885-7895 Computer engineering. Computer hardware Pada hari ini, peranti-peranti mikroelektronik menjadi lebih padat, ringan dan mempunyai lebih fungsi, ini termasuklah pakej skala cip-bertingkat (S-CSP). Ia adalah satu teknologi yang memberi opsyen kepadatan pempakejan yang tinggi. Nowadays, microelectronic devices become more compact, lighter in weight and more functional, including Stacked-Chip Scale Package (S-CSP). It is a technology which has high density packaging options. 2006-06 Thesis http://eprints.usm.my/9178/ http://eprints.usm.my/9178/1/NUMERICAL_ALGORITHM_OF_STACKED-CHIP_SCALE_PACKAGES.pdf application/pdf en public masters Universiti Sains Malaysia Pusat Pengajian Kejuruteraan Mekanikal
institution	Universiti Sains Malaysia
collection	USM Institutional Repository
language	English
topic	TK7885-7895 Computer engineering Computer hardware
spellingShingle	TK7885-7895 Computer engineering Computer hardware Abdullah, Muhammad Khalil Modelling And Analysis Of Stacked-Chip Scale Packages (S-Csps) Encapsulation Process Using Finite Difference Method [TK7874. K46 2007 f rb].
description	Pada hari ini, peranti-peranti mikroelektronik menjadi lebih padat, ringan dan mempunyai lebih fungsi, ini termasuklah pakej skala cip-bertingkat (S-CSP). Ia adalah satu teknologi yang memberi opsyen kepadatan pempakejan yang tinggi. Nowadays, microelectronic devices become more compact, lighter in weight and more functional, including Stacked-Chip Scale Package (S-CSP). It is a technology which has high density packaging options.
format	Thesis
qualification_level	Master's degree
author	Abdullah, Muhammad Khalil
author_facet	Abdullah, Muhammad Khalil
author_sort	Abdullah, Muhammad Khalil
title	Modelling And Analysis Of Stacked-Chip Scale Packages (S-Csps) Encapsulation Process Using Finite Difference Method [TK7874. K46 2007 f rb].
title_short	Modelling And Analysis Of Stacked-Chip Scale Packages (S-Csps) Encapsulation Process Using Finite Difference Method [TK7874. K46 2007 f rb].
title_full	Modelling And Analysis Of Stacked-Chip Scale Packages (S-Csps) Encapsulation Process Using Finite Difference Method [TK7874. K46 2007 f rb].
title_fullStr	Modelling And Analysis Of Stacked-Chip Scale Packages (S-Csps) Encapsulation Process Using Finite Difference Method [TK7874. K46 2007 f rb].
title_full_unstemmed	Modelling And Analysis Of Stacked-Chip Scale Packages (S-Csps) Encapsulation Process Using Finite Difference Method [TK7874. K46 2007 f rb].
title_sort	modelling and analysis of stacked-chip scale packages (s-csps) encapsulation process using finite difference method [tk7874. k46 2007 f rb].
granting_institution	Universiti Sains Malaysia
granting_department	Pusat Pengajian Kejuruteraan Mekanikal
publishDate	2006
url	http://eprints.usm.my/9178/1/NUMERICAL_ALGORITHM_OF_STACKED-CHIP_SCALE_PACKAGES.pdf
_version_	1747819761198170112

Modelling And Analysis Of Stacked-Chip Scale Packages (S-Csps) Encapsulation Process Using Finite Difference Method [TK7874. K46 2007 f rb].

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