Modelling And Analysis Of Stacked-Chip Scale Packages (S-Csps) Encapsulation Process Using Finite Difference Method [TK7874. K46 2007 f rb].
Pada hari ini, peranti-peranti mikroelektronik menjadi lebih padat, ringan dan mempunyai lebih fungsi, ini termasuklah pakej skala cip-bertingkat (S-CSP). Ia adalah satu teknologi yang memberi opsyen kepadatan pempakejan yang tinggi. Nowadays, microelectronic devices become more compact, lighter...
محفوظ في:
| المؤلف الرئيسي: | |
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| التنسيق: | أطروحة |
| اللغة: | English |
| منشور في: |
2006
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| الموضوعات: | |
| الوصول للمادة أونلاين: | http://eprints.usm.my/9178/1/NUMERICAL_ALGORITHM_OF_STACKED-CHIP_SCALE_PACKAGES.pdf |
| الوسوم: |
إضافة وسم
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my-usm-ep.9178 |
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uketd_dc |
| spelling |
my-usm-ep.91782017-04-17T09:26:37Z Modelling And Analysis Of Stacked-Chip Scale Packages (S-Csps) Encapsulation Process Using Finite Difference Method [TK7874. K46 2007 f rb]. 2006-06 Abdullah, Muhammad Khalil TK7885-7895 Computer engineering. Computer hardware Pada hari ini, peranti-peranti mikroelektronik menjadi lebih padat, ringan dan mempunyai lebih fungsi, ini termasuklah pakej skala cip-bertingkat (S-CSP). Ia adalah satu teknologi yang memberi opsyen kepadatan pempakejan yang tinggi. Nowadays, microelectronic devices become more compact, lighter in weight and more functional, including Stacked-Chip Scale Package (S-CSP). It is a technology which has high density packaging options. 2006-06 Thesis http://eprints.usm.my/9178/ http://eprints.usm.my/9178/1/NUMERICAL_ALGORITHM_OF_STACKED-CHIP_SCALE_PACKAGES.pdf application/pdf en public masters Universiti Sains Malaysia Pusat Pengajian Kejuruteraan Mekanikal |
| institution |
Universiti Sains Malaysia |
| collection |
USM Institutional Repository |
| language |
English |
| topic |
TK7885-7895 Computer engineering Computer hardware |
| spellingShingle |
TK7885-7895 Computer engineering Computer hardware Abdullah, Muhammad Khalil Modelling And Analysis Of Stacked-Chip Scale Packages (S-Csps) Encapsulation Process Using Finite Difference Method [TK7874. K46 2007 f rb]. |
| description |
Pada hari ini, peranti-peranti mikroelektronik menjadi lebih padat, ringan dan mempunyai lebih fungsi, ini termasuklah pakej skala cip-bertingkat (S-CSP). Ia adalah satu teknologi yang memberi opsyen kepadatan pempakejan yang tinggi.
Nowadays, microelectronic devices become more compact, lighter in weight and more functional, including Stacked-Chip Scale Package (S-CSP). It is a technology which has high density packaging options.
|
| format |
Thesis |
| qualification_level |
Master's degree |
| author |
Abdullah, Muhammad Khalil |
| author_facet |
Abdullah, Muhammad Khalil |
| author_sort |
Abdullah, Muhammad Khalil |
| title |
Modelling And Analysis Of Stacked-Chip Scale Packages (S-Csps) Encapsulation Process Using Finite Difference Method [TK7874. K46 2007 f rb]. |
| title_short |
Modelling And Analysis Of Stacked-Chip Scale Packages (S-Csps) Encapsulation Process Using Finite Difference Method [TK7874. K46 2007 f rb]. |
| title_full |
Modelling And Analysis Of Stacked-Chip Scale Packages (S-Csps) Encapsulation Process Using Finite Difference Method [TK7874. K46 2007 f rb]. |
| title_fullStr |
Modelling And Analysis Of Stacked-Chip Scale Packages (S-Csps) Encapsulation Process Using Finite Difference Method [TK7874. K46 2007 f rb]. |
| title_full_unstemmed |
Modelling And Analysis Of Stacked-Chip Scale Packages (S-Csps) Encapsulation Process Using Finite Difference Method [TK7874. K46 2007 f rb]. |
| title_sort |
modelling and analysis of stacked-chip scale packages (s-csps) encapsulation process using finite difference method [tk7874. k46 2007 f rb]. |
| granting_institution |
Universiti Sains Malaysia |
| granting_department |
Pusat Pengajian Kejuruteraan Mekanikal |
| publishDate |
2006 |
| url |
http://eprints.usm.my/9178/1/NUMERICAL_ALGORITHM_OF_STACKED-CHIP_SCALE_PACKAGES.pdf |
| _version_ |
1747819761198170112 |