Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization [TK7870. R165 2007 f rb].

Secara praktiknya kesemua pemasangan elektronik masa kini menggunakan pateri eutektik Sn-Pb pada antara penyambung. Akibat pertambahan penggunaan peranti elektronik dalam industri serta untuk kegunaan peribadi, maka penggunaan pateri penyambung juga bertambah. Practically all microelectronic asse...

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Main Author:	Mayappan, Ramani
Format:	Thesis
Language:	English
Published:	2007
Subjects:	TK7800-8360 Electronics
Online Access:	http://eprints.usm.my/9486/1/STUDY_ON_THE_WETTING_PROPERTIES%2C_INTERFACIAL_REACTIONS_AND_MECHANICAL_PROPERTIES_OF_Sn-Zn_AND_Sn-Zn-Bi_SOLDERS_ON_COPPER_METALLIZATION.pdf
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id	my-usm-ep.9486
record_format	uketd_dc
spelling	my-usm-ep.94862017-05-15T08:05:07Z Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization [TK7870. R165 2007 f rb]. 2007-09 Mayappan, Ramani TK7800-8360 Electronics Secara praktiknya kesemua pemasangan elektronik masa kini menggunakan pateri eutektik Sn-Pb pada antara penyambung. Akibat pertambahan penggunaan peranti elektronik dalam industri serta untuk kegunaan peribadi, maka penggunaan pateri penyambung juga bertambah. Practically all microelectronic assemblies in use today utilize Sn-Pb eutectic solder for interconnection. Due to the increase in the use of electronic devices within the industry as well as personal use, the usage of solder connections has increased. 2007-09 Thesis http://eprints.usm.my/9486/ http://eprints.usm.my/9486/1/STUDY_ON_THE_WETTING_PROPERTIES%2C_INTERFACIAL_REACTIONS_AND_MECHANICAL_PROPERTIES_OF_Sn-Zn_AND_Sn-Zn-Bi_SOLDERS_ON_COPPER_METALLIZATION.pdf application/pdf en public phd doctoral Universiti Sains Malaysia Pusat Pengajian Kejuruteraan Bahan dan Sumber Mineral
institution	Universiti Sains Malaysia
collection	USM Institutional Repository
language	English
topic	TK7800-8360 Electronics
spellingShingle	TK7800-8360 Electronics Mayappan, Ramani Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization [TK7870. R165 2007 f rb].
description	Secara praktiknya kesemua pemasangan elektronik masa kini menggunakan pateri eutektik Sn-Pb pada antara penyambung. Akibat pertambahan penggunaan peranti elektronik dalam industri serta untuk kegunaan peribadi, maka penggunaan pateri penyambung juga bertambah. Practically all microelectronic assemblies in use today utilize Sn-Pb eutectic solder for interconnection. Due to the increase in the use of electronic devices within the industry as well as personal use, the usage of solder connections has increased.
format	Thesis
qualification_name	Doctor of Philosophy (PhD.)
qualification_level	Doctorate
author	Mayappan, Ramani
author_facet	Mayappan, Ramani
author_sort	Mayappan, Ramani
title	Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization [TK7870. R165 2007 f rb].
title_short	Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization [TK7870. R165 2007 f rb].
title_full	Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization [TK7870. R165 2007 f rb].
title_fullStr	Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization [TK7870. R165 2007 f rb].
title_full_unstemmed	Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization [TK7870. R165 2007 f rb].
title_sort	study on the wetting properties, interfacial reactions and mechanical properties of sn-zn and sn-zn-bi solders on copper metallization [tk7870. r165 2007 f rb].
granting_institution	Universiti Sains Malaysia
granting_department	Pusat Pengajian Kejuruteraan Bahan dan Sumber Mineral
publishDate	2007
url	http://eprints.usm.my/9486/1/STUDY_ON_THE_WETTING_PROPERTIES%2C_INTERFACIAL_REACTIONS_AND_MECHANICAL_PROPERTIES_OF_Sn-Zn_AND_Sn-Zn-Bi_SOLDERS_ON_COPPER_METALLIZATION.pdf
_version_	1747819774835949568

Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization [TK7870. R165 2007 f rb].

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