Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization [TK7870. R165 2007 f rb].
Secara praktiknya kesemua pemasangan elektronik masa kini menggunakan pateri eutektik Sn-Pb pada antara penyambung. Akibat pertambahan penggunaan peranti elektronik dalam industri serta untuk kegunaan peribadi, maka penggunaan pateri penyambung juga bertambah. Practically all microelectronic asse...
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Main Author: | Mayappan, Ramani |
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Format: | Thesis |
Language: | English |
Published: |
2007
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Subjects: | |
Online Access: | http://eprints.usm.my/9486/1/STUDY_ON_THE_WETTING_PROPERTIES%2C_INTERFACIAL_REACTIONS_AND_MECHANICAL_PROPERTIES_OF_Sn-Zn_AND_Sn-Zn-Bi_SOLDERS_ON_COPPER_METALLIZATION.pdf |
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