Statistical approach in solving for initial and eventual wire bonding problem

The project scope is related to solve the real life Semiconductor industrial problem.Interconnection processis identifiedas the most critical process among others compared to overall flow in Semiconductor Packaging. In semiconductor manufacturing industries, ball bonding and wedge bonding technique...

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主要作者: Somasundram, Suresh Kumar
格式: Thesis
語言:English
English
出版: 2013
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spelling my-utem-ep.144622022-12-29T14:11:51Z Statistical approach in solving for initial and eventual wire bonding problem 2013 Somasundram, Suresh Kumar TK Electrical engineering. Electronics Nuclear engineering The project scope is related to solve the real life Semiconductor industrial problem.Interconnection processis identifiedas the most critical process among others compared to overall flow in Semiconductor Packaging. In semiconductor manufacturing industries, ball bonding and wedge bonding techniques are commonly adopted in the thermo compression (TIC) and thermo sonic (T/S) processes. Approximately 95% of aJI semiconductor packages are produced by applying the ball bonding method, while wedge ' bonding is applied to produce about 5% of all assembled packages. The research study has proven the ability to have robust process with optimum probe touchdown for the initial and good wire properties selection for the eventual bonding. Two years research effort covering a complete wire bondcycle involving both Initial and Eventual bonding top defective rate. As shown in the research all the aspects have been completed to derive comprehensive conclusion in-terms of material, method with support of statistical approach, the results of this research has gain good yield performance by reducing 50% of defective rate (Please refer to published papers) satisfying respective industry. 2013 Thesis http://eprints.utem.edu.my/id/eprint/14462/ http://eprints.utem.edu.my/id/eprint/14462/1/Statistical_Approach_In_Solving_For_Initial_And_Eventual_Wire_Bonding_problem012.pdf text en public http://eprints.utem.edu.my/id/eprint/14462/3/Statistical%20approach%20in%20solving%20for%20initial%20and%20eventual%20wire%20bonding%20problem.pdf text en validuser https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=85240 mphil masters Universiti Teknikal Malaysia Melaka Faculty Of Manufacturing Engineering Subramonian, Sivarao
institution Universiti Teknikal Malaysia Melaka
collection UTeM Repository
language English
English
advisor Subramonian, Sivarao
topic TK Electrical engineering
Electronics Nuclear engineering
spellingShingle TK Electrical engineering
Electronics Nuclear engineering
Somasundram, Suresh Kumar
Statistical approach in solving for initial and eventual wire bonding problem
description The project scope is related to solve the real life Semiconductor industrial problem.Interconnection processis identifiedas the most critical process among others compared to overall flow in Semiconductor Packaging. In semiconductor manufacturing industries, ball bonding and wedge bonding techniques are commonly adopted in the thermo compression (TIC) and thermo sonic (T/S) processes. Approximately 95% of aJI semiconductor packages are produced by applying the ball bonding method, while wedge ' bonding is applied to produce about 5% of all assembled packages. The research study has proven the ability to have robust process with optimum probe touchdown for the initial and good wire properties selection for the eventual bonding. Two years research effort covering a complete wire bondcycle involving both Initial and Eventual bonding top defective rate. As shown in the research all the aspects have been completed to derive comprehensive conclusion in-terms of material, method with support of statistical approach, the results of this research has gain good yield performance by reducing 50% of defective rate (Please refer to published papers) satisfying respective industry.
format Thesis
qualification_name Master of Philosophy (M.Phil.)
qualification_level Master's degree
author Somasundram, Suresh Kumar
author_facet Somasundram, Suresh Kumar
author_sort Somasundram, Suresh Kumar
title Statistical approach in solving for initial and eventual wire bonding problem
title_short Statistical approach in solving for initial and eventual wire bonding problem
title_full Statistical approach in solving for initial and eventual wire bonding problem
title_fullStr Statistical approach in solving for initial and eventual wire bonding problem
title_full_unstemmed Statistical approach in solving for initial and eventual wire bonding problem
title_sort statistical approach in solving for initial and eventual wire bonding problem
granting_institution Universiti Teknikal Malaysia Melaka
granting_department Faculty Of Manufacturing Engineering
publishDate 2013
url http://eprints.utem.edu.my/id/eprint/14462/1/Statistical_Approach_In_Solving_For_Initial_And_Eventual_Wire_Bonding_problem012.pdf
http://eprints.utem.edu.my/id/eprint/14462/3/Statistical%20approach%20in%20solving%20for%20initial%20and%20eventual%20wire%20bonding%20problem.pdf
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