Statistical approach in solving for initial and eventual wire bonding problem

The project scope is related to solve the real life Semiconductor industrial problem.Interconnection processis identifiedas the most critical process among others compared to overall flow in Semiconductor Packaging. In semiconductor manufacturing industries, ball bonding and wedge bonding technique...

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Main Author:	Somasundram, Suresh Kumar
Format:	Thesis
Language:	English English
Published:	2013
Subjects:	TK Electrical engineering Electronics Nuclear engineering
Online Access:	http://eprints.utem.edu.my/id/eprint/14462/1/Statistical_Approach_In_Solving_For_Initial_And_Eventual_Wire_Bonding_problem012.pdf http://eprints.utem.edu.my/id/eprint/14462/3/Statistical%20approach%20in%20solving%20for%20initial%20and%20eventual%20wire%20bonding%20problem.pdf
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id	my-utem-ep.14462
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spelling	my-utem-ep.144622022-12-29T14:11:51Z Statistical approach in solving for initial and eventual wire bonding problem 2013 Somasundram, Suresh Kumar TK Electrical engineering. Electronics Nuclear engineering The project scope is related to solve the real life Semiconductor industrial problem.Interconnection processis identifiedas the most critical process among others compared to overall flow in Semiconductor Packaging. In semiconductor manufacturing industries, ball bonding and wedge bonding techniques are commonly adopted in the thermo compression (TIC) and thermo sonic (T/S) processes. Approximately 95% of aJI semiconductor packages are produced by applying the ball bonding method, while wedge ' bonding is applied to produce about 5% of all assembled packages. The research study has proven the ability to have robust process with optimum probe touchdown for the initial and good wire properties selection for the eventual bonding. Two years research effort covering a complete wire bondcycle involving both Initial and Eventual bonding top defective rate. As shown in the research all the aspects have been completed to derive comprehensive conclusion in-terms of material, method with support of statistical approach, the results of this research has gain good yield performance by reducing 50% of defective rate (Please refer to published papers) satisfying respective industry. 2013 Thesis http://eprints.utem.edu.my/id/eprint/14462/ http://eprints.utem.edu.my/id/eprint/14462/1/Statistical_Approach_In_Solving_For_Initial_And_Eventual_Wire_Bonding_problem012.pdf text en public http://eprints.utem.edu.my/id/eprint/14462/3/Statistical%20approach%20in%20solving%20for%20initial%20and%20eventual%20wire%20bonding%20problem.pdf text en validuser https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=85240 mphil masters Universiti Teknikal Malaysia Melaka Faculty Of Manufacturing Engineering Subramonian, Sivarao
institution	Universiti Teknikal Malaysia Melaka
collection	UTeM Repository
language	English English
advisor	Subramonian, Sivarao
topic	TK Electrical engineering Electronics Nuclear engineering
spellingShingle	TK Electrical engineering Electronics Nuclear engineering Somasundram, Suresh Kumar Statistical approach in solving for initial and eventual wire bonding problem
description	The project scope is related to solve the real life Semiconductor industrial problem.Interconnection processis identifiedas the most critical process among others compared to overall flow in Semiconductor Packaging. In semiconductor manufacturing industries, ball bonding and wedge bonding techniques are commonly adopted in the thermo compression (TIC) and thermo sonic (T/S) processes. Approximately 95% of aJI semiconductor packages are produced by applying the ball bonding method, while wedge ' bonding is applied to produce about 5% of all assembled packages. The research study has proven the ability to have robust process with optimum probe touchdown for the initial and good wire properties selection for the eventual bonding. Two years research effort covering a complete wire bondcycle involving both Initial and Eventual bonding top defective rate. As shown in the research all the aspects have been completed to derive comprehensive conclusion in-terms of material, method with support of statistical approach, the results of this research has gain good yield performance by reducing 50% of defective rate (Please refer to published papers) satisfying respective industry.
format	Thesis
qualification_name	Master of Philosophy (M.Phil.)
qualification_level	Master's degree
author	Somasundram, Suresh Kumar
author_facet	Somasundram, Suresh Kumar
author_sort	Somasundram, Suresh Kumar
title	Statistical approach in solving for initial and eventual wire bonding problem
title_short	Statistical approach in solving for initial and eventual wire bonding problem
title_full	Statistical approach in solving for initial and eventual wire bonding problem
title_fullStr	Statistical approach in solving for initial and eventual wire bonding problem
title_full_unstemmed	Statistical approach in solving for initial and eventual wire bonding problem
title_sort	statistical approach in solving for initial and eventual wire bonding problem
granting_institution	Universiti Teknikal Malaysia Melaka
granting_department	Faculty Of Manufacturing Engineering
publishDate	2013
url	http://eprints.utem.edu.my/id/eprint/14462/1/Statistical_Approach_In_Solving_For_Initial_And_Eventual_Wire_Bonding_problem012.pdf http://eprints.utem.edu.my/id/eprint/14462/3/Statistical%20approach%20in%20solving%20for%20initial%20and%20eventual%20wire%20bonding%20problem.pdf
_version_	1776103071447777280

Statistical approach in solving for initial and eventual wire bonding problem

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