Statistical approach in solving for initial and eventual wire bonding problem

Statistical approach in solving for initial and eventual wire bonding problem

The project scope is related to solve the real life Semiconductor industrial problem.Interconnection processis identifiedas the most critical process among others compared to overall flow in Semiconductor Packaging. In semiconductor manufacturing industries, ball bonding and wedge bonding technique...

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书目详细资料
主要作者:	Somasundram, Suresh Kumar
格式:	Thesis
语言:	English English
出版:	2013
主题:	TK Electrical engineering Electronics Nuclear engineering
在线阅读:	http://eprints.utem.edu.my/id/eprint/14462/1/Statistical_Approach_In_Solving_For_Initial_And_Eventual_Wire_Bonding_problem012.pdf http://eprints.utem.edu.my/id/eprint/14462/3/Statistical%20approach%20in%20solving%20for%20initial%20and%20eventual%20wire%20bonding%20problem.pdf
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