Molding temperature control enhancement for transfer molding process via additional wire heater

In transfer molding process, molding temperature is the most vital parameter that needs to be control as tight as possible so that the optimum molding temperature is attained during transfer molding. Each type of mold compound requires different optimum molding temperature depending on their require...

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Main Author:	Zainal, Mohd Syafiq
Format:	Thesis
Language:	English English
Published:	2016
Subjects:	T Technology (General) TJ Mechanical engineering and machinery
Online Access:	http://eprints.utem.edu.my/id/eprint/20455/1/Molding%20temperature%20control%20enhancement%20for%20transfer%20molding%20process%20via%20additional%20wire%20heater.pdf http://eprints.utem.edu.my/id/eprint/20455/2/Molding%20temperature%20control%20enhancement%20for%20transfer%20molding%20process%20via%20additional%20wire%20heater.pdf
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spelling	my-utem-ep.204552022-10-25T16:09:46Z Molding temperature control enhancement for transfer molding process via additional wire heater 2016 Zainal, Mohd Syafiq T Technology (General) TJ Mechanical engineering and machinery In transfer molding process, molding temperature is the most vital parameter that needs to be control as tight as possible so that the optimum molding temperature is attained during transfer molding. Each type of mold compound requires different optimum molding temperature depending on their requirement. However to control the molding temperature is not an easy task as during molding process mold chase temperature cycle kept continuously fluctuating due to heat loss by surrounding throughout molding process. Thus a good mold chase temperature controller is a big advantage in order to obtain a quality molded product. However the Low Stress Mold Compound (LSMC) type mold compound has a very small temperature operating window by referring from the viscosity curve versus molding temperature. The optimum mold temperature for this mold compound is at 190± 3°C.Current molding machine mold chase temperature control capability is at ±5°C,therefore a new innovation method is needed on current molding machine to overcome this issue by introducing the additional wire heater near to the mold cavity surface to have better control of the mold chase temperature. With this innovation, the mold chase temperature is controlled at ± l.5°C which complies with the operating window of LSMC mold compound .By doing this, losses due to the temperature instability during molding process are reduced significantly. 2016 Thesis http://eprints.utem.edu.my/id/eprint/20455/ http://eprints.utem.edu.my/id/eprint/20455/1/Molding%20temperature%20control%20enhancement%20for%20transfer%20molding%20process%20via%20additional%20wire%20heater.pdf text en public http://eprints.utem.edu.my/id/eprint/20455/2/Molding%20temperature%20control%20enhancement%20for%20transfer%20molding%20process%20via%20additional%20wire%20heater.pdf text en validuser https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=104964 mphil masters Universiti Teknikal Malaysia Melaka Faculty of Manufacturing Engineering Abdullah, Lokman
institution	Universiti Teknikal Malaysia Melaka
collection	UTeM Repository
language	English English
advisor	Abdullah, Lokman
topic	T Technology (General) TJ Mechanical engineering and machinery
spellingShingle	T Technology (General) TJ Mechanical engineering and machinery Zainal, Mohd Syafiq Molding temperature control enhancement for transfer molding process via additional wire heater
description	In transfer molding process, molding temperature is the most vital parameter that needs to be control as tight as possible so that the optimum molding temperature is attained during transfer molding. Each type of mold compound requires different optimum molding temperature depending on their requirement. However to control the molding temperature is not an easy task as during molding process mold chase temperature cycle kept continuously fluctuating due to heat loss by surrounding throughout molding process. Thus a good mold chase temperature controller is a big advantage in order to obtain a quality molded product. However the Low Stress Mold Compound (LSMC) type mold compound has a very small temperature operating window by referring from the viscosity curve versus molding temperature. The optimum mold temperature for this mold compound is at 190± 3°C.Current molding machine mold chase temperature control capability is at ±5°C,therefore a new innovation method is needed on current molding machine to overcome this issue by introducing the additional wire heater near to the mold cavity surface to have better control of the mold chase temperature. With this innovation, the mold chase temperature is controlled at ± l.5°C which complies with the operating window of LSMC mold compound .By doing this, losses due to the temperature instability during molding process are reduced significantly.
format	Thesis
qualification_name	Master of Philosophy (M.Phil.)
qualification_level	Master's degree
author	Zainal, Mohd Syafiq
author_facet	Zainal, Mohd Syafiq
author_sort	Zainal, Mohd Syafiq
title	Molding temperature control enhancement for transfer molding process via additional wire heater
title_short	Molding temperature control enhancement for transfer molding process via additional wire heater
title_full	Molding temperature control enhancement for transfer molding process via additional wire heater
title_fullStr	Molding temperature control enhancement for transfer molding process via additional wire heater
title_full_unstemmed	Molding temperature control enhancement for transfer molding process via additional wire heater
title_sort	molding temperature control enhancement for transfer molding process via additional wire heater
granting_institution	Universiti Teknikal Malaysia Melaka
granting_department	Faculty of Manufacturing Engineering
publishDate	2016
url	http://eprints.utem.edu.my/id/eprint/20455/1/Molding%20temperature%20control%20enhancement%20for%20transfer%20molding%20process%20via%20additional%20wire%20heater.pdf http://eprints.utem.edu.my/id/eprint/20455/2/Molding%20temperature%20control%20enhancement%20for%20transfer%20molding%20process%20via%20additional%20wire%20heater.pdf
_version_	1776103104037519360

Molding temperature control enhancement for transfer molding process via additional wire heater

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