Lean manufacturing and OEE optimization of semiconductor industry through scheduled downtime reduction at testing process

Semiconductor Manufacturing Industry such as Infineon Technologies Company often looks for ways to improve their production and management processes in order to remain competitive in the market. This calls for ways to reduce production cost, enhance productivity and improve product quality. The aim...

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Main Author:	Ho, Chee Huay
Format:	Thesis
Language:	English English
Published:	2016
Subjects:	T Technology (General) TS Manufactures
Online Access:	http://eprints.utem.edu.my/id/eprint/20586/1/Lean%20manufacturing%20and%20OEE%20optimization%20of%20semiconductor%20industry%20through%20scheduled%20downtime%20reduction%20at%20testing%20process.pdf http://eprints.utem.edu.my/id/eprint/20586/2/Lean%20manufacturing%20and%20OEE%20optimization%20of%20semiconductor%20industry%20through%20scheduled%20downtime%20reduction%20at%20testing%20process.pdf
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spelling	my-utem-ep.205862022-11-11T11:32:40Z Lean manufacturing and OEE optimization of semiconductor industry through scheduled downtime reduction at testing process 2016 Ho, Chee Huay T Technology (General) TS Manufactures Semiconductor Manufacturing Industry such as Infineon Technologies Company often looks for ways to improve their production and management processes in order to remain competitive in the market. This calls for ways to reduce production cost, enhance productivity and improve product quality. The aim is to utilize all the available resources efficiently and effectively in order to provide their customers with high quality products at a low price. Aimed at these motives, several improvement strategies and tools had been proposed to satisfy the organization's needs. Such initiatives include optimizing the Overall Equipment Effectiveness (OEE),lean manufacturing and others. Machine performance is one of the critical factors which reflects productivity capability and often is measured by OEE.A steep production demand ramp-up in year 2015 threatened a potentially huge investment for Microflex machines in Infineon. The objective of the study is to optimize OEE loss of scheduled downtime by reducing change lot duration in order to improve the OEE of MicroFlex machines. DMAIC is one of the adopted systematic approaches to identify the gaps. The biggest challenge is the high complexity of OEE losses that comes from multi-dimensional influencing factors. Several ideas were transformed into holistic and realistic approaches. With zero defect quality in mind, it has never been compromising in quality in the course of action to improve OEE. The most important criteria to an OEE improvement project is to have tracking system categorized its OEE factors and sources of loss in a manner that allow continuous focus on specific correlation of equipment performance. Many lean tools are applied in the report such as Kaizen, MED,MOST Technique, PDCA, SIPOC and others. Several hypotheses are made to seek on the potential improvement plans for change lot time reduction. Each of the hypotheses are verified in the pilot run and justified based on the time study simulation. The overall improvement activities introduced in the study are manufacturing wastes elimination, SMED concept converting the internal activity to external activity and others. Last but not least, the study has successful optimized the scheduled downtime through change lot time reduction after implementation of improvement activities. The results are positive which the scheduled downtime is reduced from 4.1% to 2.9%.Also,the change lot time has shortening from 12.9 minutes to 7.43 minutes. 2016 Thesis http://eprints.utem.edu.my/id/eprint/20586/ http://eprints.utem.edu.my/id/eprint/20586/1/Lean%20manufacturing%20and%20OEE%20optimization%20of%20semiconductor%20industry%20through%20scheduled%20downtime%20reduction%20at%20testing%20process.pdf text en public http://eprints.utem.edu.my/id/eprint/20586/2/Lean%20manufacturing%20and%20OEE%20optimization%20of%20semiconductor%20industry%20through%20scheduled%20downtime%20reduction%20at%20testing%20process.pdf text en validuser https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=104972 mphil masters Universiti Teknikal Malaysia Melaka Faculty of Manufacturing Engineering Salleh, Mohd Rizal
institution	Universiti Teknikal Malaysia Melaka
collection	UTeM Repository
language	English English
advisor	Salleh, Mohd Rizal
topic	T Technology (General) TS Manufactures
spellingShingle	T Technology (General) TS Manufactures Ho, Chee Huay Lean manufacturing and OEE optimization of semiconductor industry through scheduled downtime reduction at testing process
description	Semiconductor Manufacturing Industry such as Infineon Technologies Company often looks for ways to improve their production and management processes in order to remain competitive in the market. This calls for ways to reduce production cost, enhance productivity and improve product quality. The aim is to utilize all the available resources efficiently and effectively in order to provide their customers with high quality products at a low price. Aimed at these motives, several improvement strategies and tools had been proposed to satisfy the organization's needs. Such initiatives include optimizing the Overall Equipment Effectiveness (OEE),lean manufacturing and others. Machine performance is one of the critical factors which reflects productivity capability and often is measured by OEE.A steep production demand ramp-up in year 2015 threatened a potentially huge investment for Microflex machines in Infineon. The objective of the study is to optimize OEE loss of scheduled downtime by reducing change lot duration in order to improve the OEE of MicroFlex machines. DMAIC is one of the adopted systematic approaches to identify the gaps. The biggest challenge is the high complexity of OEE losses that comes from multi-dimensional influencing factors. Several ideas were transformed into holistic and realistic approaches. With zero defect quality in mind, it has never been compromising in quality in the course of action to improve OEE. The most important criteria to an OEE improvement project is to have tracking system categorized its OEE factors and sources of loss in a manner that allow continuous focus on specific correlation of equipment performance. Many lean tools are applied in the report such as Kaizen, MED,MOST Technique, PDCA, SIPOC and others. Several hypotheses are made to seek on the potential improvement plans for change lot time reduction. Each of the hypotheses are verified in the pilot run and justified based on the time study simulation. The overall improvement activities introduced in the study are manufacturing wastes elimination, SMED concept converting the internal activity to external activity and others. Last but not least, the study has successful optimized the scheduled downtime through change lot time reduction after implementation of improvement activities. The results are positive which the scheduled downtime is reduced from 4.1% to 2.9%.Also,the change lot time has shortening from 12.9 minutes to 7.43 minutes.
format	Thesis
qualification_name	Master of Philosophy (M.Phil.)
qualification_level	Master's degree
author	Ho, Chee Huay
author_facet	Ho, Chee Huay
author_sort	Ho, Chee Huay
title	Lean manufacturing and OEE optimization of semiconductor industry through scheduled downtime reduction at testing process
title_short	Lean manufacturing and OEE optimization of semiconductor industry through scheduled downtime reduction at testing process
title_full	Lean manufacturing and OEE optimization of semiconductor industry through scheduled downtime reduction at testing process
title_fullStr	Lean manufacturing and OEE optimization of semiconductor industry through scheduled downtime reduction at testing process
title_full_unstemmed	Lean manufacturing and OEE optimization of semiconductor industry through scheduled downtime reduction at testing process
title_sort	lean manufacturing and oee optimization of semiconductor industry through scheduled downtime reduction at testing process
granting_institution	Universiti Teknikal Malaysia Melaka
granting_department	Faculty of Manufacturing Engineering
publishDate	2016
url	http://eprints.utem.edu.my/id/eprint/20586/1/Lean%20manufacturing%20and%20OEE%20optimization%20of%20semiconductor%20industry%20through%20scheduled%20downtime%20reduction%20at%20testing%20process.pdf http://eprints.utem.edu.my/id/eprint/20586/2/Lean%20manufacturing%20and%20OEE%20optimization%20of%20semiconductor%20industry%20through%20scheduled%20downtime%20reduction%20at%20testing%20process.pdf
_version_	1776103109915836416

Lean manufacturing and OEE optimization of semiconductor industry through scheduled downtime reduction at testing process

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