Preparation & characterization of electrophoretically deposited BN film for semiconductor package
Boron Nitride (BN) is used in various applications such as in lubrication, as a releasing agent and also as a thermosetting insulator material and thermal enhancer because of its advanced material properties. Electrophoretic deposition (EPD) method is a new method for semiconductor industries and it...
محفوظ في:
| المؤلف الرئيسي: | |
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| التنسيق: | أطروحة |
| اللغة: | English English |
| منشور في: |
2017
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| الموضوعات: | |
| الوصول للمادة أونلاين: | http://eprints.utem.edu.my/id/eprint/20612/1/Preparation%20%26%20Characterization%20Of%20Electrophoretically%20Deposited%20BN%20Film%20For%20Semiconductor%20Package.pdf http://eprints.utem.edu.my/id/eprint/20612/2/Preparation%20%26%20characterization%20of%20electrophoretically%20deposited%20BN%20film%20for%20semiconductor%20package.pdf |
| الوسوم: |
إضافة وسم
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الانترنت
http://eprints.utem.edu.my/id/eprint/20612/1/Preparation%20%26%20Characterization%20Of%20Electrophoretically%20Deposited%20BN%20Film%20For%20Semiconductor%20Package.pdfhttp://eprints.utem.edu.my/id/eprint/20612/2/Preparation%20%26%20characterization%20of%20electrophoretically%20deposited%20BN%20film%20for%20semiconductor%20package.pdf