Design and analysis of electrical testing probe for semiconductor integrated circuit

In the field of Test and Measurement in Semiconductor industry, where measuring small resistances are necessary on Semiconductor IC (Integrated Circuit). Nowadays given the fact that electronics gadgets are evaluated become more advanced, the size of the gadgets is getting smaller and smaller, and...

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Main Author:	Wong, Michael Loke Peng
Format:	Thesis
Language:	English English
Published:	2016
Subjects:	T Technology (General)
Online Access:	http://eprints.utem.edu.my/id/eprint/21105/1/Design%20And%20Analysis%20Of%20Electrical%20Testing%20Probe%20For%20Semiconductor%20Integrated%20Circuit.pdf http://eprints.utem.edu.my/id/eprint/21105/2/Design%20and%20analysis%20of%20electrical%20testing%20probe%20for%20semiconductor%20integrated%20circuit.pdf
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id	my-utem-ep.21105
record_format	uketd_dc
spelling	my-utem-ep.211052022-09-20T13:22:32Z Design and analysis of electrical testing probe for semiconductor integrated circuit 2016 Wong, Michael Loke Peng T Technology (General) TK Electrical engineering. Electronics Nuclear engineering In the field of Test and Measurement in Semiconductor industry, where measuring small resistances are necessary on Semiconductor IC (Integrated Circuit). Nowadays given the fact that electronics gadgets are evaluated become more advanced, the size of the gadgets is getting smaller and smaller, and getting cheaper in terms of price, this is a result of human kind is evaluating to advancement of electronics world. In this project, testing robe for Semiconductor IC was design to equip with self-sustaining scrubbing function, sustainable contact force and higher life span by Computer Aided Design (CAD). Then the most appropriate Testing Probe was selected by Analytical Hierarchy Process (AHP), which the pair-wise comparison matrix is constructed with the goal of Scrubbing function (SF), Contact force (CF), Low resistivity (LR), High current (HC), and Life span (LS). To analyze the designed Testing Probe for Semiconductor IC which fulfill the criteria, the test probe was undergo Finite Element Analysis (FEA) to determine the optimum Fatigue stress, Yield strength, maximum stress and displacement. Then the test probe was simulated under testing condition, data such as contact resistance CRES and displacement of test probe was collected until it reach its maximum life spend of 1.3 million touchdown. As result the most appropriate test probe was selected, which fulfilled all of the requirements. 2016 Thesis http://eprints.utem.edu.my/id/eprint/21105/ http://eprints.utem.edu.my/id/eprint/21105/1/Design%20And%20Analysis%20Of%20Electrical%20Testing%20Probe%20For%20Semiconductor%20Integrated%20Circuit.pdf text en public http://eprints.utem.edu.my/id/eprint/21105/2/Design%20and%20analysis%20of%20electrical%20testing%20probe%20for%20semiconductor%20integrated%20circuit.pdf text en validuser https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=104917 mphil masters Universiti Teknikal Malaysia Melaka Faculty Of Manufacturing Engineering
institution	Universiti Teknikal Malaysia Melaka
collection	UTeM Repository
language	English English
topic	T Technology (General) T Technology (General)
spellingShingle	T Technology (General) T Technology (General) Wong, Michael Loke Peng Design and analysis of electrical testing probe for semiconductor integrated circuit
description	In the field of Test and Measurement in Semiconductor industry, where measuring small resistances are necessary on Semiconductor IC (Integrated Circuit). Nowadays given the fact that electronics gadgets are evaluated become more advanced, the size of the gadgets is getting smaller and smaller, and getting cheaper in terms of price, this is a result of human kind is evaluating to advancement of electronics world. In this project, testing robe for Semiconductor IC was design to equip with self-sustaining scrubbing function, sustainable contact force and higher life span by Computer Aided Design (CAD). Then the most appropriate Testing Probe was selected by Analytical Hierarchy Process (AHP), which the pair-wise comparison matrix is constructed with the goal of Scrubbing function (SF), Contact force (CF), Low resistivity (LR), High current (HC), and Life span (LS). To analyze the designed Testing Probe for Semiconductor IC which fulfill the criteria, the test probe was undergo Finite Element Analysis (FEA) to determine the optimum Fatigue stress, Yield strength, maximum stress and displacement. Then the test probe was simulated under testing condition, data such as contact resistance CRES and displacement of test probe was collected until it reach its maximum life spend of 1.3 million touchdown. As result the most appropriate test probe was selected, which fulfilled all of the requirements.
format	Thesis
qualification_name	Master of Philosophy (M.Phil.)
qualification_level	Master's degree
author	Wong, Michael Loke Peng
author_facet	Wong, Michael Loke Peng
author_sort	Wong, Michael Loke Peng
title	Design and analysis of electrical testing probe for semiconductor integrated circuit
title_short	Design and analysis of electrical testing probe for semiconductor integrated circuit
title_full	Design and analysis of electrical testing probe for semiconductor integrated circuit
title_fullStr	Design and analysis of electrical testing probe for semiconductor integrated circuit
title_full_unstemmed	Design and analysis of electrical testing probe for semiconductor integrated circuit
title_sort	design and analysis of electrical testing probe for semiconductor integrated circuit
granting_institution	Universiti Teknikal Malaysia Melaka
granting_department	Faculty Of Manufacturing Engineering
publishDate	2016
url	http://eprints.utem.edu.my/id/eprint/21105/1/Design%20And%20Analysis%20Of%20Electrical%20Testing%20Probe%20For%20Semiconductor%20Integrated%20Circuit.pdf http://eprints.utem.edu.my/id/eprint/21105/2/Design%20and%20analysis%20of%20electrical%20testing%20probe%20for%20semiconductor%20integrated%20circuit.pdf
_version_	1747834010518683648

Design and analysis of electrical testing probe for semiconductor integrated circuit

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