APA引文

Badaruddin, N. I. (2018). Optimization of secondary bonding in layup process based on six sigma method.

Chicago Style (17th ed.) Citation

Badaruddin, Nur Izayu. Optimization of Secondary Bonding in Layup Process Based on Six Sigma Method. 2018.

MLA引文

Badaruddin, Nur Izayu. Optimization of Secondary Bonding in Layup Process Based on Six Sigma Method. 2018.

警告：這些引文格式不一定是100％准確.