Implementation of overall equipment effectiveness in surface mounting technology

The purpose of this paper is to study on implementing Overall Equipment Effectiveness (OEE) in Surface Mounting Technology (SMT) for Flexible Circuit Board Assembly Industry. OEE comprises of Availability, Performance and Quality which able to identify six major losses in the manufacturing which con...

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Main Author:	V. Nanjan, Davandran
Format:	Thesis
Language:	English English
Published:	2019
Subjects:	T Technology (General) TS Manufactures
Online Access:	http://eprints.utem.edu.my/id/eprint/25164/1/Implementation%20Of%20Overall%20Equipment%20Effectiveness%20In%20Surface%20Mounting%20Technology.pdf http://eprints.utem.edu.my/id/eprint/25164/2/Implementation%20of%20overall%20equipment%20effectiveness%20in%20surface%20mounting%20technology.pdf
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id	my-utem-ep.25164
record_format	uketd_dc
institution	Universiti Teknikal Malaysia Melaka
collection	UTeM Repository
language	English English
advisor	Salleh, Mohd Rizal
topic	T Technology (General) TS Manufactures
spellingShingle	T Technology (General) TS Manufactures V. Nanjan, Davandran Implementation of overall equipment effectiveness in surface mounting technology
description	The purpose of this paper is to study on implementing Overall Equipment Effectiveness (OEE) in Surface Mounting Technology (SMT) for Flexible Circuit Board Assembly Industry. OEE comprises of Availability, Performance and Quality which able to identify six major losses in the manufacturing which consist of machine breakdown, set up and adjustment, minor stoppages, reduce speed, starl-up rejection and production reject However, this study focused on reduced speed loss whereas printing speed is not as accordance mentioned in solder paste technical data sheet, The solder paste and machine capable to print with 100mm/s but actual setting is slower which was a loss that was identified. Therefore, printing speed been standardised and the consequence from it being analysed and improved. Prior to this, the weaknesses identified on Availability, Performance and Quality which decreasts the OEE ratio. Hence, PDCA methodology being adapted in this study as a proper plan to identify the root causes and implementation of improvement action to enhance OEE ratio. The PDCA implementation have been supported by tools such as brainstorming, Ishikawa diagram, Five Why’s technique and Kaizen. As consequence, two improvement activities introduced which are pallet cooling system and laser cut stainless steel stencil with Nano-coating. Pallet coolingsystem implemented to overcome the machine idling due to waiting pallet to cool down. Hence, this implementation reduced pallet cooling time from the current stage of approximately 300 seconds to below 120 seconds. The next improvement action was laser cut stencil with Nano-coating implemented to improve paste transfer efficiency. Hence, paste volume was measured and data shows stencil with coating achieved better volume on the soldering pad which was 153.86% compare to stencil without coating which are at 108.24%. Thercfore, it improved the quality yield by reducing open joint solder short defeets. The result of this study shows by adapting these tools, Availability achieved target set of 85% while Performance improved to consistently above 70% and Quality ratio above 98%. As a result, OEE shows improvement which consistently achieved above 60%.
format	Thesis
qualification_name	Master of Philosophy (M.Phil.)
qualification_level	Master's degree
author	V. Nanjan, Davandran
author_facet	V. Nanjan, Davandran
author_sort	V. Nanjan, Davandran
title	Implementation of overall equipment effectiveness in surface mounting technology
title_short	Implementation of overall equipment effectiveness in surface mounting technology
title_full	Implementation of overall equipment effectiveness in surface mounting technology
title_fullStr	Implementation of overall equipment effectiveness in surface mounting technology
title_full_unstemmed	Implementation of overall equipment effectiveness in surface mounting technology
title_sort	implementation of overall equipment effectiveness in surface mounting technology
granting_institution	Universiti Teknikal Malaysia Melaka
granting_department	Faculty Of Manufacturing Engineering
publishDate	2019
url	http://eprints.utem.edu.my/id/eprint/25164/1/Implementation%20Of%20Overall%20Equipment%20Effectiveness%20In%20Surface%20Mounting%20Technology.pdf http://eprints.utem.edu.my/id/eprint/25164/2/Implementation%20of%20overall%20equipment%20effectiveness%20in%20surface%20mounting%20technology.pdf
_version_	1747834109575561216
spelling	my-utem-ep.251642022-06-13T09:33:42Z Implementation of overall equipment effectiveness in surface mounting technology 2019 V. Nanjan, Davandran T Technology (General) TS Manufactures The purpose of this paper is to study on implementing Overall Equipment Effectiveness (OEE) in Surface Mounting Technology (SMT) for Flexible Circuit Board Assembly Industry. OEE comprises of Availability, Performance and Quality which able to identify six major losses in the manufacturing which consist of machine breakdown, set up and adjustment, minor stoppages, reduce speed, starl-up rejection and production reject However, this study focused on reduced speed loss whereas printing speed is not as accordance mentioned in solder paste technical data sheet, The solder paste and machine capable to print with 100mm/s but actual setting is slower which was a loss that was identified. Therefore, printing speed been standardised and the consequence from it being analysed and improved. Prior to this, the weaknesses identified on Availability, Performance and Quality which decreasts the OEE ratio. Hence, PDCA methodology being adapted in this study as a proper plan to identify the root causes and implementation of improvement action to enhance OEE ratio. The PDCA implementation have been supported by tools such as brainstorming, Ishikawa diagram, Five Why’s technique and Kaizen. As consequence, two improvement activities introduced which are pallet cooling system and laser cut stainless steel stencil with Nano-coating. Pallet coolingsystem implemented to overcome the machine idling due to waiting pallet to cool down. Hence, this implementation reduced pallet cooling time from the current stage of approximately 300 seconds to below 120 seconds. The next improvement action was laser cut stencil with Nano-coating implemented to improve paste transfer efficiency. Hence, paste volume was measured and data shows stencil with coating achieved better volume on the soldering pad which was 153.86% compare to stencil without coating which are at 108.24%. Thercfore, it improved the quality yield by reducing open joint solder short defeets. The result of this study shows by adapting these tools, Availability achieved target set of 85% while Performance improved to consistently above 70% and Quality ratio above 98%. As a result, OEE shows improvement which consistently achieved above 60%. 2019 Thesis http://eprints.utem.edu.my/id/eprint/25164/ http://eprints.utem.edu.my/id/eprint/25164/1/Implementation%20Of%20Overall%20Equipment%20Effectiveness%20In%20Surface%20Mounting%20Technology.pdf text en 2023-08-05 staffonly http://eprints.utem.edu.my/id/eprint/25164/2/Implementation%20of%20overall%20equipment%20effectiveness%20in%20surface%20mounting%20technology.pdf text en validuser https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=117853 mphil masters Universiti Teknikal Malaysia Melaka Faculty Of Manufacturing Engineering Salleh, Mohd Rizal 1. Andersson, C. and Bellgran, M. (2015) ‘On the complexity of using performance measures: Enhancing sustained production improvement capability by combining OEE and productivity’, Journal of Manufacturing Systems. The Society of Manufacturing Engineers, 35, pp. 144–154. 2. Barsalou, M., n.d. Root Cause Analysis, Ishikawa Diagram and the 5 Whys. 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Implementation of overall equipment effectiveness in surface mounting technology

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