The Study Of Temperature Analysis On Fusible Metal Bonding Application

The Study Of Temperature Analysis On Fusible Metal Bonding Application

High frequency packages become very important due to the rapid growth of wireless communication system. They require compactness, low cost and high performances ever at frequency up to 60 GHz. Flip-chip device assembly using organic substrates at very high frequency has become a cost competitive pac...

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Main Author: Gnanasegaran, Yogeswaran
Format: Thesis
Language:English
English
Published: 2020
Subjects:
T Technology (General)
TS Manufactures
Online Access:http://eprints.utem.edu.my/id/eprint/25496/1/The%20Study%20Of%20Temperature%20Analysis%20On%20Fusible%20Metal%20Bonding%20Application.pdf
http://eprints.utem.edu.my/id/eprint/25496/2/The%20Study%20Of%20Temperature%20Analysis%20On%20Fusible%20Metal%20Bonding%20Application.pdf
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record_format uketd_dc
institution Universiti Teknikal Malaysia Melaka
collection UTeM Repository
language English
English
advisor Yusof, Ahmad Anas
topic T Technology (General)
TS Manufactures
spellingShingle T Technology (General)
TS Manufactures
Gnanasegaran, Yogeswaran
The Study Of Temperature Analysis On Fusible Metal Bonding Application
description High frequency packages become very important due to the rapid growth of wireless communication system. They require compactness, low cost and high performances ever at frequency up to 60 GHz. Flip-chip device assembly using organic substrates at very high frequency has become a cost competitive packaging method in semiconductor industries. This thesis discusses the influence of temperature on copper pillar solder joints contact to the surface of the substrate after reflow respect to staging time by using flip chip device. Samples of the flip chip devices will be bonded under selected temperature and then will undergo cross section of sample to determine the failure analysis of flip chip bonded after reflow process .Therefore, different temperature and staging time in bonding process can cause the bonding mechanism of flip chip copper pillar to have less adhesion and copper pillar crack at the neck of the pillar. Besides that, the nature of solder contributes to poor solder wetting and low thermal conductivity. For an example, the behavior of Sn-based solder in term of thermal conductivity and solder wetting characteristic. The test results shows that, the copper pillar solder can be productively sustain the solder joint of the thermal fatigue life cycle and the formation of intermetallic compound (IMC). The basic requirements of the joining material and the process will be discuss in this study. In future, experimental research on the performance of solder joint with different type of temperature is required. In summary, improvement towards the flip chip die bonding process which by controlling the optimum temperature and staging time would overall be a driving force towards the development of similar packages with more demanding requirements towards the existing flip chip packages.
format Thesis
qualification_name Master of Philosophy (M.Phil.)
qualification_level Master's degree
author Gnanasegaran, Yogeswaran
author_facet Gnanasegaran, Yogeswaran
author_sort Gnanasegaran, Yogeswaran
title The Study Of Temperature Analysis On Fusible Metal Bonding Application
title_short The Study Of Temperature Analysis On Fusible Metal Bonding Application
title_full The Study Of Temperature Analysis On Fusible Metal Bonding Application
title_fullStr The Study Of Temperature Analysis On Fusible Metal Bonding Application
title_full_unstemmed The Study Of Temperature Analysis On Fusible Metal Bonding Application
title_sort study of temperature analysis on fusible metal bonding application
granting_institution Universiti Teknikal Malaysia Melaka
granting_department Faculty Of Mechanical Engineering
publishDate 2020
url http://eprints.utem.edu.my/id/eprint/25496/1/The%20Study%20Of%20Temperature%20Analysis%20On%20Fusible%20Metal%20Bonding%20Application.pdf
http://eprints.utem.edu.my/id/eprint/25496/2/The%20Study%20Of%20Temperature%20Analysis%20On%20Fusible%20Metal%20Bonding%20Application.pdf
_version_ 1747834133840658432
spelling my-utem-ep.254962022-01-06T11:50:17Z The Study Of Temperature Analysis On Fusible Metal Bonding Application 2020 Gnanasegaran, Yogeswaran T Technology (General) TS Manufactures High frequency packages become very important due to the rapid growth of wireless communication system. They require compactness, low cost and high performances ever at frequency up to 60 GHz. Flip-chip device assembly using organic substrates at very high frequency has become a cost competitive packaging method in semiconductor industries. This thesis discusses the influence of temperature on copper pillar solder joints contact to the surface of the substrate after reflow respect to staging time by using flip chip device. Samples of the flip chip devices will be bonded under selected temperature and then will undergo cross section of sample to determine the failure analysis of flip chip bonded after reflow process .Therefore, different temperature and staging time in bonding process can cause the bonding mechanism of flip chip copper pillar to have less adhesion and copper pillar crack at the neck of the pillar. Besides that, the nature of solder contributes to poor solder wetting and low thermal conductivity. For an example, the behavior of Sn-based solder in term of thermal conductivity and solder wetting characteristic. The test results shows that, the copper pillar solder can be productively sustain the solder joint of the thermal fatigue life cycle and the formation of intermetallic compound (IMC). The basic requirements of the joining material and the process will be discuss in this study. In future, experimental research on the performance of solder joint with different type of temperature is required. In summary, improvement towards the flip chip die bonding process which by controlling the optimum temperature and staging time would overall be a driving force towards the development of similar packages with more demanding requirements towards the existing flip chip packages. 2020 Thesis http://eprints.utem.edu.my/id/eprint/25496/ http://eprints.utem.edu.my/id/eprint/25496/1/The%20Study%20Of%20Temperature%20Analysis%20On%20Fusible%20Metal%20Bonding%20Application.pdf text en public http://eprints.utem.edu.my/id/eprint/25496/2/The%20Study%20Of%20Temperature%20Analysis%20On%20Fusible%20Metal%20Bonding%20Application.pdf text en validuser https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=119739 mphil masters Universiti Teknikal Malaysia Melaka Faculty Of Mechanical Engineering Yusof, Ahmad Anas 1. Annuar, S., Mahmoodian, R., Hamdi, M. , and Tu, K.N., 2017. 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