Elimination Of Metal Stiffener Lifted Issue In Flexible Printed Circuit Board

Nowadays, flexible printed circuit board also well known as flexible circuit is considered as the most efficient design block in electronic system operation. In basic construction of flexible circuit, there are additional material stiffener require to added for giving mechanical support on component...

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Main Author:	Safri, Syarnila
Format:	Thesis
Language:	English English
Published:	2020
Subjects:	T Technology (General)
Online Access:	http://eprints.utem.edu.my/id/eprint/25546/1/Elimination%20Of%20Metal%20Stiffener%20Lifted%20Issue%20In%20Flexible%20Printed%20Circuit%20Board.pdf http://eprints.utem.edu.my/id/eprint/25546/2/Elimination%20Of%20Metal%20Stiffener%20Lifted%20Issue%20In%20Flexible%20Printed%20Circuit%20Board.pdf
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id	my-utem-ep.25546
record_format	uketd_dc
institution	Universiti Teknikal Malaysia Melaka
collection	UTeM Repository
language	English English
advisor	Ismail, Syahriza
topic	T Technology (General) T Technology (General)
spellingShingle	T Technology (General) T Technology (General) Safri, Syarnila Elimination Of Metal Stiffener Lifted Issue In Flexible Printed Circuit Board
description	Nowadays, flexible printed circuit board also well known as flexible circuit is considered as the most efficient design block in electronic system operation. In basic construction of flexible circuit, there are additional material stiffener require to added for giving mechanical support on components and connectors due to its dynamic and flexible structure. There are various types of stiffener applied in manufacturing of flexible circuit. Metal stiffener is one of the common material chosen in thickening the flex thickness and eventually provide functionality base ground to the electric and electronic device system. However, due to some distortion, metal stiffener lifted issue is repeatedly occur and escapee to customer end user. Therefore, this study are being carried out to analyze and eliminate the metal stiffener lifted issue during manufacturing of flexible printed circuit board through several trial and eror experimental investigation. This study investigated the suitable types of metal stiffener adhesive material together with types of pressing machine process in applying the metal stiffener on surface of flexible circuit. Generally, all potential root cause have been solved by using Ishikawa diagram through the five factors such as man's, methodology, environment control, machine and material. However, further study are require to select the suitable types of metal stiffener adhesive material and types of pressing machine to ensure the sustainability. Moreover, this experimental investigation performance are able to be measured by using three types of quality inspection which are visual inspection, peel strength test, and temperature-humidity test. Hence, as a summary of this study, non conductive pyralux dupont LF without adhesive material and with using lamination pressing machine model LFD-200 is determine and validate to be successful in eliminating the metal stiffener lifted issue in manufacturing of flexible printed circuit board. As a result, there are no records of customer complaint on metal stiffener lifted issue since the selection is implemented and production yield automatically increased and maintain at high range.
format	Thesis
qualification_name	Master of Philosophy (M.Phil.)
qualification_level	Master's degree
author	Safri, Syarnila
author_facet	Safri, Syarnila
author_sort	Safri, Syarnila
title	Elimination Of Metal Stiffener Lifted Issue In Flexible Printed Circuit Board
title_short	Elimination Of Metal Stiffener Lifted Issue In Flexible Printed Circuit Board
title_full	Elimination Of Metal Stiffener Lifted Issue In Flexible Printed Circuit Board
title_fullStr	Elimination Of Metal Stiffener Lifted Issue In Flexible Printed Circuit Board
title_full_unstemmed	Elimination Of Metal Stiffener Lifted Issue In Flexible Printed Circuit Board
title_sort	elimination of metal stiffener lifted issue in flexible printed circuit board
granting_institution	Universiti Teknikal Malaysia Melaka
granting_department	Faculty of Manufacturing Engineering
publishDate	2020
url	http://eprints.utem.edu.my/id/eprint/25546/1/Elimination%20Of%20Metal%20Stiffener%20Lifted%20Issue%20In%20Flexible%20Printed%20Circuit%20Board.pdf http://eprints.utem.edu.my/id/eprint/25546/2/Elimination%20Of%20Metal%20Stiffener%20Lifted%20Issue%20In%20Flexible%20Printed%20Circuit%20Board.pdf
_version_	1747834137743458304
spelling	my-utem-ep.255462022-01-06T12:29:09Z Elimination Of Metal Stiffener Lifted Issue In Flexible Printed Circuit Board 2020 Safri, Syarnila T Technology (General) TK Electrical engineering. Electronics Nuclear engineering Nowadays, flexible printed circuit board also well known as flexible circuit is considered as the most efficient design block in electronic system operation. In basic construction of flexible circuit, there are additional material stiffener require to added for giving mechanical support on components and connectors due to its dynamic and flexible structure. There are various types of stiffener applied in manufacturing of flexible circuit. Metal stiffener is one of the common material chosen in thickening the flex thickness and eventually provide functionality base ground to the electric and electronic device system. However, due to some distortion, metal stiffener lifted issue is repeatedly occur and escapee to customer end user. Therefore, this study are being carried out to analyze and eliminate the metal stiffener lifted issue during manufacturing of flexible printed circuit board through several trial and eror experimental investigation. This study investigated the suitable types of metal stiffener adhesive material together with types of pressing machine process in applying the metal stiffener on surface of flexible circuit. Generally, all potential root cause have been solved by using Ishikawa diagram through the five factors such as man's, methodology, environment control, machine and material. However, further study are require to select the suitable types of metal stiffener adhesive material and types of pressing machine to ensure the sustainability. Moreover, this experimental investigation performance are able to be measured by using three types of quality inspection which are visual inspection, peel strength test, and temperature-humidity test. Hence, as a summary of this study, non conductive pyralux dupont LF without adhesive material and with using lamination pressing machine model LFD-200 is determine and validate to be successful in eliminating the metal stiffener lifted issue in manufacturing of flexible printed circuit board. As a result, there are no records of customer complaint on metal stiffener lifted issue since the selection is implemented and production yield automatically increased and maintain at high range. 2020 Thesis http://eprints.utem.edu.my/id/eprint/25546/ http://eprints.utem.edu.my/id/eprint/25546/1/Elimination%20Of%20Metal%20Stiffener%20Lifted%20Issue%20In%20Flexible%20Printed%20Circuit%20Board.pdf text en public http://eprints.utem.edu.my/id/eprint/25546/2/Elimination%20Of%20Metal%20Stiffener%20Lifted%20Issue%20In%20Flexible%20Printed%20Circuit%20Board.pdf text en validuser https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=119196 mphil masters Universiti Teknikal Malaysia Melaka Faculty of Manufacturing Engineering Ismail, Syahriza 1. Alwaidh, A., Sharp, M. and French, P. (2014). Laser processing of rigid and flexible PCBs. Optics and Lasers in Engineering, 58, pp.109-113. 2. Cai, D. and Neyer, A. (2010). Polysiloxane based flexible electrical-optical-circuits-board. Microelectronic Engineering, 87(11), pp.2268-2274. 3. Dexerials. (2019). Dexerials. [online] Available at: http://www.dexerials.jp/en/ [Accessed 26 Nov. 2019], 4. Dobrusskin, C. (2016). On the Identification of Contradictions Using Cause Effect Chain Analysis. Procedia CIRP, 39, pp.221-224. Dupont.com. (2019). [online] Available at: https://www.dupont.com/content/dam/dupont/products-and-services/electronic-andelectrical-materials/flexible-rigid-flex circuitmaterials/documents/PyraluxLFadhesive_DataSheet.pdf [Accessed 26 Nov. 2019], 5. Eom, J. and Kim, S. (2008). Plasma surface treatment of polyimide for adhesive Cu/80Ni20Cr/PI flexible copper clad laminate. Thin Solid Films, 516(14), pp.4530-4534. 6. Fjelstad, J. (2011). Flexible circuit technology. Seaside, OR: BR Publishing. 7. Gcaflex.com. (2019). History of Flexible Circuits, Printed Flex Boards \| GC Aero Flexible Circuitry, Inc., [online] Available at: https://gcaflex.com/flexible-circuits/history-offlexible-circuits/ [Accessed 26 Nov. 2019], Ipc.org. (n.d.). [online] Available at: https://www.ipc.Org/TM/2.4.9d.pdf [Accessed 28 Oct. 2019], 8. Ipc.org. (2019). IPC Releases T-50 Revision M, Terms and Definitions for Interconnecting and Packaging Electronic Circuits \| IPC. [online] Available at: https://www.ipc.org/ContentPage.aspx?Pageid=IPC-Releases-T-50-Revision-M-Termsand-Defmitions-for-Interconnecting-and-Packaging-Electronic-Circuits [Accessed 26 Nov. 2019], 9. Kamiya, S., Furuta, H. and Omiya, M. (2007). Adhesion energy of Cu/polyimide interface in flexible printed circuits. Surface and Coatings Technology, 202(4-7), pp.1084-1088. 10. Meng, B., Tang, W., Zhang, X., Han, M., Liu, W. and Zhang, H. (2013). Self-powered flexible printed circuit board with integrated triboelectric generator. Nano Energy, 2(6), pp.l101-1106. Magazines007.com. (2019). [online] Available at: http://www.magazines007.com/pdf/Flex007-Apr2019.pdffAccessed 29 Dec. 2019], 11. MFS Technology (M) Sdn bhd. (2019) FA#19-015. Failure analysis report on Metal Stiffener Lifted Issue. 12. MFS Technology (M) Sdn bhd. (2018) FA#18-050. Failure analysis report on Metal Stiffener Lifted Issue. 13. Mfstech.com.sg. (2019). MFS :: Home, [online] Available at: http://www.mfstech.com.sg/ [Accessed 1 Jun. 2019]. 14. Mun, M., Kim, D., Kim, D. and Yeom, G. (2019). Plasma press for improved adhesion between flexible polymer substrate and inorganic material. International Journal of Adhesion and Adhesives, 89, pp.59-65. 15. Noh, B., Yoon, J. and Jung, S. (2011). Fabrication and adhesion strength of Cu/NiCr/polyimide films for flexible printed circuits. Microelectronic Engineering, 88(6), pp.1024-1027. 16. Noh, B., Yoon, J. and Jung, S. (2010). Effect of laminating parameters on the adhesion property of flexible copper clad laminate with adhesive layer. International Journal of Adhesion and Adhesives, 30(1), pp.30-35. 17. Park, S. and Park, Y. (2010). Effect of CF4 plasma treatment on the interfacial fracture energy between inkjet-printed Ag and flexible polyimide films. Surface and Coatings Technology, 205(2), pp.423-429. 18. Tome, P. (2017). The Purpose of a Flex Circuit Stiffener, [online] Blog.epectec.com. Available at: https://blog.epectec.com/the-purpose-of-a-flex-circuit-stiffener. [Accessed 30 May. 2019],

Elimination Of Metal Stiffener Lifted Issue In Flexible Printed Circuit Board

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