Experimental Investigation Of Mechanical Dicing Parameters On The Quality Of Thin Glass Wafer Cutting Process

Silicon-glass device has been adopted in the industry especially used on applications like pressure sensor, accelerometer, microfluidic device, micropump, microturbine, and micro-actuator. In this study, the focus of the package application is current sensors with component of an ultra-thin silicon...

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Main Author:	Liou, Jacqueline Jing Wen
Format:	Thesis
Language:	English English
Published:	2020
Subjects:	T Technology (General) TJ Mechanical engineering and machinery
Online Access:	http://eprints.utem.edu.my/id/eprint/25573/1/Experimental%20Investigation%20Of%20Mechanical%20Dicing%20Parameters%20On%20The%20Quality%20Of%20Thin%20Glass%20Wafer%20Cutting%20Process.pdf http://eprints.utem.edu.my/id/eprint/25573/2/Experimental%20Investigation%20Of%20Mechanical%20Dicing%20Parameters%20On%20The%20Quality%20Of%20Thin%20Glass%20Wafer%20Cutting%20Process.pdf
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id	my-utem-ep.25573
record_format	uketd_dc
institution	Universiti Teknikal Malaysia Melaka
collection	UTeM Repository
language	English English
advisor	Jamli, Mohamad Ridzuan
topic	T Technology (General) TJ Mechanical engineering and machinery
spellingShingle	T Technology (General) TJ Mechanical engineering and machinery Liou, Jacqueline Jing Wen Experimental Investigation Of Mechanical Dicing Parameters On The Quality Of Thin Glass Wafer Cutting Process
description	Silicon-glass device has been adopted in the industry especially used on applications like pressure sensor, accelerometer, microfluidic device, micropump, microturbine, and micro-actuator. In this study, the focus of the package application is current sensors with component of an ultra-thin silicon device bonded on top of a thin glass chip. Other than that, both of the chip is mounted on DAF tape for a cheaper assembly solution. There are no experience in Infineon to process glass wafer mounted on DAF dicing tape which is a key challenges in this project. Hence, the purpose of this study was to create a solution in die separation of glass wafer. Therefore, it is crucial that process characterisation of glass wafer dicing by using mechanical dicing method. This project is defined to comply with automotive specifications especially on dicing induced quality risk such as top side chipping, side wall chipping, back side chipping and other defects. Research and philosophy on glass wafer dicing method is harvested and referred as past experience learning. Design of experiments is developed based on the critical parameters in mechanical dicing. Then, the result will based on design model method by using Minitab software. With the help of response surface methodology, optimized parameters has been selected. The outcome of this project is glass wafer dicing are able to finalized by using mechanical dicing method with the optmized parameters. Out of 11 DOEs, DOE 7 has been selected as the best solution and repeatability run has shown positive results. However, blade life study is recommended to perform as the blade used are new resin blade.
format	Thesis
qualification_name	Master of Philosophy (M.Phil.)
qualification_level	Master's degree
author	Liou, Jacqueline Jing Wen
author_facet	Liou, Jacqueline Jing Wen
author_sort	Liou, Jacqueline Jing Wen
title	Experimental Investigation Of Mechanical Dicing Parameters On The Quality Of Thin Glass Wafer Cutting Process
title_short	Experimental Investigation Of Mechanical Dicing Parameters On The Quality Of Thin Glass Wafer Cutting Process
title_full	Experimental Investigation Of Mechanical Dicing Parameters On The Quality Of Thin Glass Wafer Cutting Process
title_fullStr	Experimental Investigation Of Mechanical Dicing Parameters On The Quality Of Thin Glass Wafer Cutting Process
title_full_unstemmed	Experimental Investigation Of Mechanical Dicing Parameters On The Quality Of Thin Glass Wafer Cutting Process
title_sort	experimental investigation of mechanical dicing parameters on the quality of thin glass wafer cutting process
granting_institution	Universiti Teknikal Malaysia Melaka
granting_department	Faculty of Manufacturing Engineering
publishDate	2020
url	http://eprints.utem.edu.my/id/eprint/25573/1/Experimental%20Investigation%20Of%20Mechanical%20Dicing%20Parameters%20On%20The%20Quality%20Of%20Thin%20Glass%20Wafer%20Cutting%20Process.pdf http://eprints.utem.edu.my/id/eprint/25573/2/Experimental%20Investigation%20Of%20Mechanical%20Dicing%20Parameters%20On%20The%20Quality%20Of%20Thin%20Glass%20Wafer%20Cutting%20Process.pdf
_version_	1747834142252335104
spelling	my-utem-ep.255732022-01-06T14:09:41Z Experimental Investigation Of Mechanical Dicing Parameters On The Quality Of Thin Glass Wafer Cutting Process 2020 Liou, Jacqueline Jing Wen T Technology (General) TJ Mechanical engineering and machinery Silicon-glass device has been adopted in the industry especially used on applications like pressure sensor, accelerometer, microfluidic device, micropump, microturbine, and micro-actuator. In this study, the focus of the package application is current sensors with component of an ultra-thin silicon device bonded on top of a thin glass chip. Other than that, both of the chip is mounted on DAF tape for a cheaper assembly solution. There are no experience in Infineon to process glass wafer mounted on DAF dicing tape which is a key challenges in this project. Hence, the purpose of this study was to create a solution in die separation of glass wafer. Therefore, it is crucial that process characterisation of glass wafer dicing by using mechanical dicing method. This project is defined to comply with automotive specifications especially on dicing induced quality risk such as top side chipping, side wall chipping, back side chipping and other defects. Research and philosophy on glass wafer dicing method is harvested and referred as past experience learning. Design of experiments is developed based on the critical parameters in mechanical dicing. Then, the result will based on design model method by using Minitab software. With the help of response surface methodology, optimized parameters has been selected. The outcome of this project is glass wafer dicing are able to finalized by using mechanical dicing method with the optmized parameters. Out of 11 DOEs, DOE 7 has been selected as the best solution and repeatability run has shown positive results. However, blade life study is recommended to perform as the blade used are new resin blade. 2020 Thesis http://eprints.utem.edu.my/id/eprint/25573/ http://eprints.utem.edu.my/id/eprint/25573/1/Experimental%20Investigation%20Of%20Mechanical%20Dicing%20Parameters%20On%20The%20Quality%20Of%20Thin%20Glass%20Wafer%20Cutting%20Process.pdf text en 2025-08-26 validuser http://eprints.utem.edu.my/id/eprint/25573/2/Experimental%20Investigation%20Of%20Mechanical%20Dicing%20Parameters%20On%20The%20Quality%20Of%20Thin%20Glass%20Wafer%20Cutting%20Process.pdf text en 2025-08-26 validuser https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=119122 mphil masters Universiti Teknikal Malaysia Melaka Faculty of Manufacturing Engineering Jamli, Mohamad Ridzuan 1. A Riveiro, F Quintero, F Lusquiños, R. C. and J. P. (2011). Study of melt flow dynamics and influence on quality for CO2 laser fusion cutting. Journal of Physics D: Applied Physics, 44(13). 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Experimental Investigation Of Mechanical Dicing Parameters On The Quality Of Thin Glass Wafer Cutting Process

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