Optimizing Electroplating Process Parameter And Sn-Plating Thickness Uniformity Using Modified Shielding

Optimizing Electroplating Process Parameter And Sn-Plating Thickness Uniformity Using Modified Shielding

Uneven plating thickness distribution across plated surface has become a major challenge in electroplating industry even for advanced plating technology today due to complexity of package design. LPL HD package encounter low plating thickness on the heatsink area, but thicker on lead area. Due to th...

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Main Author: Suieb, Nurhanim
Format: Thesis
Language:English
English
Published: 2020
Subjects:
T Technology (General)
TS Manufactures
Online Access:http://eprints.utem.edu.my/id/eprint/25581/2/Optimizing%20Electroplating%20Process%20Parameter%20And%20Sn-Plating%20Thickness%20Uniformity%20Using%20Modified%20Shielding.pdf
http://eprints.utem.edu.my/id/eprint/25581/3/Optimizing%20Electroplating%20Process%20Parameter%20And%20Sn-Plating%20Thickness%20Uniformity%20Using%20Modified%20Shielding.pdf
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id my-utem-ep.25581
record_format uketd_dc
institution Universiti Teknikal Malaysia Melaka
collection UTeM Repository
language English
English
advisor Raja Abdullah, Izamshah
topic T Technology (General)
TS Manufactures
spellingShingle T Technology (General)
TS Manufactures
Suieb, Nurhanim
Optimizing Electroplating Process Parameter And Sn-Plating Thickness Uniformity Using Modified Shielding
description Uneven plating thickness distribution across plated surface has become a major challenge in electroplating industry even for advanced plating technology today due to complexity of package design. LPL HD package encounter low plating thickness on the heatsink area, but thicker on lead area. Due to this phenomena, manufacturer encounter high losses due to plating thickness not meeting required package design specification. A number of natural phenomena occur in the electroplating process has cause the material to be deposited unevenly on the leadframe. One of the factors is due to complexity of lead frame geometry design and size of targeted surface area. The shields offer a high resistance path to the material ions from anodes to cathode. Therefore this research will study the most appropriate process parameters (current and speed) of electroplating to improve Sn-plating thickness uniformity using modified mechanical shielding. Taguchi method is adopted to reduce the size of experiment and optimize the process parameters simultaneously. As a result, new parameter has been established which offer ideal plating thickness with less variation and stable Cpk. This is due to excellent design of shielding, the plating thickness on complex leadframes able to achieve good uniformity. The modified shielding proven has effectively reduce the thickness variation on lead as it reduces the high current setting subject to it. While the effect of optimized parameters successfully assessed thoroughly during validation phase with convincing result. The optimized parameter is current 120 A and speed 3.46 m/min with 90% agreement on lead while only 489% on heatsink after validate with production condition.
format Thesis
qualification_name Master of Philosophy (M.Phil.)
qualification_level Master's degree
author Suieb, Nurhanim
author_facet Suieb, Nurhanim
author_sort Suieb, Nurhanim
title Optimizing Electroplating Process Parameter And Sn-Plating Thickness Uniformity Using Modified Shielding
title_short Optimizing Electroplating Process Parameter And Sn-Plating Thickness Uniformity Using Modified Shielding
title_full Optimizing Electroplating Process Parameter And Sn-Plating Thickness Uniformity Using Modified Shielding
title_fullStr Optimizing Electroplating Process Parameter And Sn-Plating Thickness Uniformity Using Modified Shielding
title_full_unstemmed Optimizing Electroplating Process Parameter And Sn-Plating Thickness Uniformity Using Modified Shielding
title_sort optimizing electroplating process parameter and sn-plating thickness uniformity using modified shielding
granting_institution Universiti Teknikal Malaysia Melaka
granting_department Faculty of Manufacturing Engineering
publishDate 2020
url http://eprints.utem.edu.my/id/eprint/25581/2/Optimizing%20Electroplating%20Process%20Parameter%20And%20Sn-Plating%20Thickness%20Uniformity%20Using%20Modified%20Shielding.pdf
http://eprints.utem.edu.my/id/eprint/25581/3/Optimizing%20Electroplating%20Process%20Parameter%20And%20Sn-Plating%20Thickness%20Uniformity%20Using%20Modified%20Shielding.pdf
_version_ 1747834143535792128
spelling my-utem-ep.255812022-01-06T14:27:33Z Optimizing Electroplating Process Parameter And Sn-Plating Thickness Uniformity Using Modified Shielding 2020 Suieb, Nurhanim T Technology (General) TS Manufactures Uneven plating thickness distribution across plated surface has become a major challenge in electroplating industry even for advanced plating technology today due to complexity of package design. LPL HD package encounter low plating thickness on the heatsink area, but thicker on lead area. Due to this phenomena, manufacturer encounter high losses due to plating thickness not meeting required package design specification. A number of natural phenomena occur in the electroplating process has cause the material to be deposited unevenly on the leadframe. One of the factors is due to complexity of lead frame geometry design and size of targeted surface area. The shields offer a high resistance path to the material ions from anodes to cathode. Therefore this research will study the most appropriate process parameters (current and speed) of electroplating to improve Sn-plating thickness uniformity using modified mechanical shielding. Taguchi method is adopted to reduce the size of experiment and optimize the process parameters simultaneously. As a result, new parameter has been established which offer ideal plating thickness with less variation and stable Cpk. This is due to excellent design of shielding, the plating thickness on complex leadframes able to achieve good uniformity. The modified shielding proven has effectively reduce the thickness variation on lead as it reduces the high current setting subject to it. While the effect of optimized parameters successfully assessed thoroughly during validation phase with convincing result. The optimized parameter is current 120 A and speed 3.46 m/min with 90% agreement on lead while only 489% on heatsink after validate with production condition. 2020 Thesis http://eprints.utem.edu.my/id/eprint/25581/ http://eprints.utem.edu.my/id/eprint/25581/2/Optimizing%20Electroplating%20Process%20Parameter%20And%20Sn-Plating%20Thickness%20Uniformity%20Using%20Modified%20Shielding.pdf text en 2025-08-24 validuser http://eprints.utem.edu.my/id/eprint/25581/3/Optimizing%20Electroplating%20Process%20Parameter%20And%20Sn-Plating%20Thickness%20Uniformity%20Using%20Modified%20Shielding.pdf text en 2025-08-24 validuser https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=119193 mphil masters Universiti Teknikal Malaysia Melaka Faculty of Manufacturing Engineering Raja Abdullah, Izamshah 1. Abbott, D. C. (2003). US. Patent No. 6,545,344. Washington, DC: U.S. Patent and Trademark Office. 2. Abbott, B. C., & Moehle, P. R. (2001). US.Patent No. 6,194,777. 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US.Patent No. 6,802,950.Washington, DC: U.S. Patent and Trademark Office. 7. Hwang, Y., Park, Y. H., Lee, S. W., & Lee, K. H. (2016). Nanoscale Thickness Control of Pulse-Plated Gold Layer on Leadframe by TuningAnode Shield. Journal of Nanoscience and Nanotechnology, 16(11), 11137-11142. doi:10.1166ljnn.2016.13467 8. Kinghorn, D. H. (1995). US. Patent No. 5,454,929. Washington, DC: U.S. Patent and TrademarkOfice. 9. Kotadia, H. R., Mokhtari, O., Clode, M. P., Green, M. A., & Mannan, S. H. (2012). Intermetallic compound growth suppression at high temperature in SAC solders with Zn addition on Cu and Ni-P substrates. Journal ofAlloys and Compounds,511(1), 176-1 88. 10. Kroupa, A., Watson, A., Mucklejohn, S., Ipser, H., Dinsdale, A., & Andersson, D. (2016). Lead-Free Soldering: Environmentally Friendly Electronics. In Green and Sustainable Manufacturing of AdvancedMaterial (pp. 1 01-134). Elsevier. 11. Nakadaira, Y., Matsuura, T., Tsuriya, M., Nhat, D. V., Kangas, R., Conrad, J., & Arunasalam, S. M. (2001, December). Pb-free plating for peripherallieadframe packages. In Proceedings Second International Symposium on Environmentally Conscious Design and Inverse Manufacturing (pp. 213-218). IEEE. 12. Ojo, A. A., & Dharmadasa, I. M. (2018). Electroplating of semiconductor materials for applicationsin large area electronics: A review. Coatings, 8(8), 262. 13. Pruitt, D. A., & Maier, L. (201 1). US.Patent No. 8,076,181. Washington, DC: U.S. Patent and Trademark Ofice. 14. Schetty, R., & Sepp, B. (2006). Implementation of lead-free component finishes in mass production: acceptance test requirements must be diligently evaluated before any lead-free plating alternative is validated. Metal Finishing, 104(1O), 50-55. 15. Sharma, A., Bhattacharya, S., Das, S., & Das, K. (2014). A study on the effect of pulse electrodeposition parameters on the morphology of pure tin coatings. Metallurgical and Materials TransactionsA, 45(1O), 4610-4622. 16. Sharma, A., Bhattacharya, S., Sen, R., Reddy, B. S. B., Fecht, H. J., Das, K., & Das, S. (2012). Influenceof current density on microstructure of pulse electrodepositedtin coatings. Materials characterization, 68,22-32. 17. Sharma, A., Das, K., Fecht, H. J., & Das, S. (2014). Effect of various additives on morphological and structural characteristics of pulse electrodeposited tin coatings from stannous sulfate electrolyte.Applied Surface Science, 314, 5 16-522. 18. Sharma, A., Das, S., & Das, K. (201 7). Effect of different electrolyteson the microstructure, corrosion and whisker growth of pulse plated tin coatings. Microelectronic Engineering, 170,59-68. 19. Sriyarunya, A. (2004, January). Manufacturability and reliability of lead-free package. In 2004 InternationalIEEE Conference on the Asian Green Electronics (AGEC).Proceedings of (pp. 105-109). IEEE. 20. Tan, A. C. (1992). Tin and Solderplating in the semiconductor industry. Springer Science & Business Media. 21. Wang, H. T., Ong, C. H., Wang, X. J., Li, W. H., & Ng, L. P. (2017, December). Study of critical load force towards thin plating on pre-plated leadframe. In 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) (pp. 1-6)

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