Interfacial adhesion between silver ink and thermoplastic polyurethane and electromechanical reliability of flexible printed circuit

Flexible printed circuit (FPC) is one of the promising components in the electronic industries. The advantages of FPC are that its fabrication process is environmentally friendly, low cost, and efficient, which makes it a favourable choice for applications in industrial and medical. The conductive i...

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Bibliographic Details
Main Author: Mohd Yunos, Afiqah
Format: Thesis
Language:English
English
Published: 2021
Subjects:
Online Access:http://eprints.utem.edu.my/id/eprint/25974/1/Interfacial%20adhesion%20between%20silver%20ink%20and%20thermoplastic%20polyurethane%20and%20electromechanical%20reliability%20of%20flexible%20printed%20circuit.pdf
http://eprints.utem.edu.my/id/eprint/25974/2/Interfacial%20adhesion%20between%20silver%20ink%20and%20thermoplastic%20polyurethane%20and%20electromechanical%20reliability%20of%20flexible%20printed%20circuit.pdf
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