Surfaces (Technology) Surface preparation Coating processes Tungsten carbide-cobalt alloys
Within electronics industry, flexible printed circuits (FPC) are compiled in stacks to achieve smaller sizes and higher component density. The architecture size of a computer processor has been shrunk from 10 µm to 7 nm from year 1971 to 2020. In order to meet the market expectation, manufacturers h...
محفوظ في:
| المؤلف الرئيسي: | |
|---|---|
| التنسيق: | أطروحة |
| اللغة: | English English |
| منشور في: |
2021
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| الموضوعات: | |
| الوصول للمادة أونلاين: | http://eprints.utem.edu.my/id/eprint/26053/1/Optimisation%20of%20copper%20via%20filling%20characteristics%20on%20flexible%20printed%20circuit.pdf http://eprints.utem.edu.my/id/eprint/26053/2/Optimisation%20of%20copper%20via%20filling%20characteristics%20on%20flexible%20printed%20circuit.pdf |
| الوسوم: |
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