Fluid dynamic simulation for diffusion solder die bond

This thesis investigates the computational fluid dynamics simulation of NiSn diffusion solder die bond process simulation methodology. As semiconductor industry is moving towards manufacturing complex and cost saving packages, more material and process methodology is being explored. The current appr...

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Main Author:	Nandagopal, Vanisha Ashweeni
Format:	Thesis
Language:	English English
Published:	2021
Subjects:	T Technology (General)
Online Access:	http://eprints.utem.edu.my/id/eprint/26853/1/Fluid%20dynamic%20simulation%20for%20diffusion%20solder%20die%20bond.pdf http://eprints.utem.edu.my/id/eprint/26853/2/Fluid%20dynamic%20simulation%20for%20diffusion%20solder%20die%20bond.pdf
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id	my-utem-ep.26853
record_format	uketd_dc
spelling	my-utem-ep.268532023-05-17T09:16:03Z Fluid dynamic simulation for diffusion solder die bond 2021 Nandagopal, Vanisha Ashweeni T Technology (General) TA Engineering (General). Civil engineering (General) This thesis investigates the computational fluid dynamics simulation of NiSn diffusion solder die bond process simulation methodology. As semiconductor industry is moving towards manufacturing complex and cost saving packages, more material and process methodology is being explored. The current approach of the semiconductor manufacturing industry has resulted in many new materials that are able to save manufacturing cost, but has the same or a better performance as the existing material. Simulation is useful during these product development activities in order to predict the process parameters and output results under multiple desired conditions. A general computational fluid dynamics model that represents packages of different material conditions, process temperature and material properties is derived. Multiple process parameters are considered during the simulation such as machine temperature profile, material properties and et cetera. These simulations are utilizing finite element method in ANSYS simulation software. The stress simulation is done on die bond process to analyze the robustness of the materials at every assembly step before it is assembled into one single package. A complete analysis is compiled to deter-mine the performance of new material on die bond process so that necessary measures and precautions can be done. The results of the study indicate that the computational fluid dynamics model is a general model that is limited to material properties. The computational fluid dynamics model is limited to a few package size groups. In the future, investigation can be extended into different applications that supports other multiple industries. 2021 Thesis http://eprints.utem.edu.my/id/eprint/26853/ http://eprints.utem.edu.my/id/eprint/26853/1/Fluid%20dynamic%20simulation%20for%20diffusion%20solder%20die%20bond.pdf text en 2026 validuser http://eprints.utem.edu.my/id/eprint/26853/2/Fluid%20dynamic%20simulation%20for%20diffusion%20solder%20die%20bond.pdf text en 2026 validuser https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=121725 mphil masters Universiti Teknikal Malaysia Melaka Faculty of Manufacturing Engineering Subramonian, Sivarao
institution	Universiti Teknikal Malaysia Melaka
collection	UTeM Repository
language	English English
advisor	Subramonian, Sivarao
topic	T Technology (General) T Technology (General)
spellingShingle	T Technology (General) T Technology (General) Nandagopal, Vanisha Ashweeni Fluid dynamic simulation for diffusion solder die bond
description	This thesis investigates the computational fluid dynamics simulation of NiSn diffusion solder die bond process simulation methodology. As semiconductor industry is moving towards manufacturing complex and cost saving packages, more material and process methodology is being explored. The current approach of the semiconductor manufacturing industry has resulted in many new materials that are able to save manufacturing cost, but has the same or a better performance as the existing material. Simulation is useful during these product development activities in order to predict the process parameters and output results under multiple desired conditions. A general computational fluid dynamics model that represents packages of different material conditions, process temperature and material properties is derived. Multiple process parameters are considered during the simulation such as machine temperature profile, material properties and et cetera. These simulations are utilizing finite element method in ANSYS simulation software. The stress simulation is done on die bond process to analyze the robustness of the materials at every assembly step before it is assembled into one single package. A complete analysis is compiled to deter-mine the performance of new material on die bond process so that necessary measures and precautions can be done. The results of the study indicate that the computational fluid dynamics model is a general model that is limited to material properties. The computational fluid dynamics model is limited to a few package size groups. In the future, investigation can be extended into different applications that supports other multiple industries.
format	Thesis
qualification_name	Master of Philosophy (M.Phil.)
qualification_level	Master's degree
author	Nandagopal, Vanisha Ashweeni
author_facet	Nandagopal, Vanisha Ashweeni
author_sort	Nandagopal, Vanisha Ashweeni
title	Fluid dynamic simulation for diffusion solder die bond
title_short	Fluid dynamic simulation for diffusion solder die bond
title_full	Fluid dynamic simulation for diffusion solder die bond
title_fullStr	Fluid dynamic simulation for diffusion solder die bond
title_full_unstemmed	Fluid dynamic simulation for diffusion solder die bond
title_sort	fluid dynamic simulation for diffusion solder die bond
granting_institution	Universiti Teknikal Malaysia Melaka
granting_department	Faculty of Manufacturing Engineering
publishDate	2021
url	http://eprints.utem.edu.my/id/eprint/26853/1/Fluid%20dynamic%20simulation%20for%20diffusion%20solder%20die%20bond.pdf http://eprints.utem.edu.my/id/eprint/26853/2/Fluid%20dynamic%20simulation%20for%20diffusion%20solder%20die%20bond.pdf
_version_	1776103146996629504

Fluid dynamic simulation for diffusion solder die bond

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