Fluid dynamic simulation for diffusion solder die bond

Fluid dynamic simulation for diffusion solder die bond

This thesis investigates the computational fluid dynamics simulation of NiSn diffusion solder die bond process simulation methodology. As semiconductor industry is moving towards manufacturing complex and cost saving packages, more material and process methodology is being explored. The current appr...

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书目详细资料
主要作者:	Nandagopal, Vanisha Ashweeni
格式:	Thesis
语言:	English English
出版:	2021
主题:	T Technology (General)
在线阅读:	http://eprints.utem.edu.my/id/eprint/26853/1/Fluid%20dynamic%20simulation%20for%20diffusion%20solder%20die%20bond.pdf http://eprints.utem.edu.my/id/eprint/26853/2/Fluid%20dynamic%20simulation%20for%20diffusion%20solder%20die%20bond.pdf
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