Plasma etching process for aluminum-copper metallization by photoresist margin improvement for CMOS 0.13-µm technology

In wafer fabrication manufacturing, the aluminum etching process is a dry plasma etching process used as the main process for construction of aluminum copper (AlCu) interconnect structures. As customer requirements changed for faster, more reliable and lower cost chips, chip manufacturers have learn...

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主要作者: Mohamed Hassan, Wan Faizal
格式: Thesis
语言:English
English
出版: 2022
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在线阅读:http://eprints.utem.edu.my/id/eprint/26870/1/Plasma%20etching%20process%20for%20aluminum-copper%20metallization%20by%20photoresist%20margin%20improvement%20for%20CMOS%200.13-%C2%B5m%20technology.pdf
http://eprints.utem.edu.my/id/eprint/26870/2/Plasma%20etching%20process%20for%20aluminum-copper%20metallization%20by%20photoresist%20margin%20improvement%20for%20CMOS%200.13-%C2%B5m%20technology.pdf
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