Experimental and simulation study on lead-free solders and electroless nickel immersion silver surface finish

Simulation technology has come a long way in recent years technologies play an important role in revolutionising many industries including electronic industries. Thermal simulation provides deeper insights into a product’s behavior with different temperature scenarios, and the designs will be impact...

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Main Author:	Hashim, Muhammad Syafiq
Format:	Thesis
Language:	English English English
Published:	2023
Subjects:	TA Engineering (General) Civil engineering (General)
Online Access:	http://eprints.uthm.edu.my/10981/1/24p%20MUHAMMAD%20SYAFIQ%20HASHIM.pdf http://eprints.uthm.edu.my/10981/2/MUHAMMAD%20SYAFIQ%20HASHIM%20COPYRIGHT%20DECLARATION.pdf http://eprints.uthm.edu.my/10981/3/MUHAMMAD%20SYAFIQ%20HASHIM%20WATERMARK.pdf
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id	my-uthm-ep.10981
record_format	uketd_dc
spelling	my-uthm-ep.109812024-05-20T01:28:37Z Experimental and simulation study on lead-free solders and electroless nickel immersion silver surface finish 2023-07 Hashim, Muhammad Syafiq TA Engineering (General). Civil engineering (General) Simulation technology has come a long way in recent years technologies play an important role in revolutionising many industries including electronic industries. Thermal simulation provides deeper insights into a product’s behavior with different temperature scenarios, and the designs will be impacted by temperature changes. Knowing these outcomes enables to quickly adjust designs to achieve peak product performance. Therefore, this study aims to investigate the experimental and simulation on lead-free solders with ENIMAG finish. The PCB package's thermal distribution and total deformation were simulated using the ANSYS software. For experimental study, two low melting point of lead-free solders was used which are Sn-40Bi, Sn-4.0Zn-40Bi and Sn-3.0Ag-0.5Cu as comparison. ENIMAG/Cu was used as a substrate and was reflowed at 150°C for both Sn-40Bi and Sn-4.0Zn-40Bi lead-free solders. Then the substrate undergone isothermal aging process at 55°C for Sn-40Bi and Sn-4.0Zn-40Bi and different aging durations (250, 500, and 750 hours). The top surface and cross-sectional examination were characterised using optical microscope and scanning electron microscopy (SEM). The results revealed that both thermal distribution in steady-state and transient thermal shows temperature over the PCB surface is equilibrium and even for both reflow temperatures during reflow soldering and aging process. The temperature of the PCB becomes close to the ambient temperature at the end of the given time and high at the middle of PCB. For aging process, there was no or small deviation was observed for all parameters. The lowest temperature is recorded on the edge of the PCB in some cases, but the deviation is minor at 0.001°C. For aging process, maximum stress on the PCB is 195.59 MPa and minimum stress is 5.9326 MPa for 150°C while for 250°C is 753.51 MPa and 22.856 MPa for maximum and minimum stress, respectively. Besides, in the as-reflow condition, the IMC thickness for Sn-40Bi is thinner than Sn-4.0Zn-40Bi and SAC305 solder. Duplex IMC of (Cu,Ni)6Sn5 and (Ni,Cu)3Sn4 was detected at the interface of solder joint for all solder materials. During isothermal aging process, the IMC thickness for Sn-40Bi is maintain thinner than Sn-4.0Zn-40Bi and SAC305 solder. However, The IMC thickness is increased when the aging duration is increased for all solder materials. Moreover, the grain sizes of IMC morphology are changing to become rounder and denser when it was exposed to aging process 2023-07 Thesis http://eprints.uthm.edu.my/10981/ http://eprints.uthm.edu.my/10981/1/24p%20MUHAMMAD%20SYAFIQ%20HASHIM.pdf text en public http://eprints.uthm.edu.my/10981/2/MUHAMMAD%20SYAFIQ%20HASHIM%20COPYRIGHT%20DECLARATION.pdf text en staffonly http://eprints.uthm.edu.my/10981/3/MUHAMMAD%20SYAFIQ%20HASHIM%20WATERMARK.pdf text en validuser mphil masters Universiti Tun Hussein Onn Malaysia Fakulti Kejuruteraan Mekanikal dan Pembuatan
institution	Universiti Tun Hussein Onn Malaysia
collection	UTHM Institutional Repository
language	English English English
topic	TA Engineering (General) Civil engineering (General)
spellingShingle	TA Engineering (General) Civil engineering (General) Hashim, Muhammad Syafiq Experimental and simulation study on lead-free solders and electroless nickel immersion silver surface finish
description	Simulation technology has come a long way in recent years technologies play an important role in revolutionising many industries including electronic industries. Thermal simulation provides deeper insights into a product’s behavior with different temperature scenarios, and the designs will be impacted by temperature changes. Knowing these outcomes enables to quickly adjust designs to achieve peak product performance. Therefore, this study aims to investigate the experimental and simulation on lead-free solders with ENIMAG finish. The PCB package's thermal distribution and total deformation were simulated using the ANSYS software. For experimental study, two low melting point of lead-free solders was used which are Sn-40Bi, Sn-4.0Zn-40Bi and Sn-3.0Ag-0.5Cu as comparison. ENIMAG/Cu was used as a substrate and was reflowed at 150°C for both Sn-40Bi and Sn-4.0Zn-40Bi lead-free solders. Then the substrate undergone isothermal aging process at 55°C for Sn-40Bi and Sn-4.0Zn-40Bi and different aging durations (250, 500, and 750 hours). The top surface and cross-sectional examination were characterised using optical microscope and scanning electron microscopy (SEM). The results revealed that both thermal distribution in steady-state and transient thermal shows temperature over the PCB surface is equilibrium and even for both reflow temperatures during reflow soldering and aging process. The temperature of the PCB becomes close to the ambient temperature at the end of the given time and high at the middle of PCB. For aging process, there was no or small deviation was observed for all parameters. The lowest temperature is recorded on the edge of the PCB in some cases, but the deviation is minor at 0.001°C. For aging process, maximum stress on the PCB is 195.59 MPa and minimum stress is 5.9326 MPa for 150°C while for 250°C is 753.51 MPa and 22.856 MPa for maximum and minimum stress, respectively. Besides, in the as-reflow condition, the IMC thickness for Sn-40Bi is thinner than Sn-4.0Zn-40Bi and SAC305 solder. Duplex IMC of (Cu,Ni)6Sn5 and (Ni,Cu)3Sn4 was detected at the interface of solder joint for all solder materials. During isothermal aging process, the IMC thickness for Sn-40Bi is maintain thinner than Sn-4.0Zn-40Bi and SAC305 solder. However, The IMC thickness is increased when the aging duration is increased for all solder materials. Moreover, the grain sizes of IMC morphology are changing to become rounder and denser when it was exposed to aging process
format	Thesis
qualification_name	Master of Philosophy (M.Phil.)
qualification_level	Master's degree
author	Hashim, Muhammad Syafiq
author_facet	Hashim, Muhammad Syafiq
author_sort	Hashim, Muhammad Syafiq
title	Experimental and simulation study on lead-free solders and electroless nickel immersion silver surface finish
title_short	Experimental and simulation study on lead-free solders and electroless nickel immersion silver surface finish
title_full	Experimental and simulation study on lead-free solders and electroless nickel immersion silver surface finish
title_fullStr	Experimental and simulation study on lead-free solders and electroless nickel immersion silver surface finish
title_full_unstemmed	Experimental and simulation study on lead-free solders and electroless nickel immersion silver surface finish
title_sort	experimental and simulation study on lead-free solders and electroless nickel immersion silver surface finish
granting_institution	Universiti Tun Hussein Onn Malaysia
granting_department	Fakulti Kejuruteraan Mekanikal dan Pembuatan
publishDate	2023
url	http://eprints.uthm.edu.my/10981/1/24p%20MUHAMMAD%20SYAFIQ%20HASHIM.pdf http://eprints.uthm.edu.my/10981/2/MUHAMMAD%20SYAFIQ%20HASHIM%20COPYRIGHT%20DECLARATION.pdf http://eprints.uthm.edu.my/10981/3/MUHAMMAD%20SYAFIQ%20HASHIM%20WATERMARK.pdf
_version_	1804890130641584128

Experimental and simulation study on lead-free solders and electroless nickel immersion silver surface finish

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