Investigation on plasma properties for deposition of titanium nitride film using reactive magnetron sputtering system

Deposition of thin film using plasma sputtering system had been widely discovered and developed extensively for many years in technological and industrial process especially formation of titanium nitride (TiN) films due to its high hardness, good wear resistance, low friction coeffcient and chemical...

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Main Author: Soo, Reh How
Format: Thesis
Language:English
English
English
Published: 2018
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Online Access:http://eprints.uthm.edu.my/245/1/24p%20SOO%20REH%20HOW.pdf
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spelling my-uthm-ep.2452021-07-13T03:37:10Z Investigation on plasma properties for deposition of titanium nitride film using reactive magnetron sputtering system 2018-06 Soo, Reh How TK7800-8360 Electronics Deposition of thin film using plasma sputtering system had been widely discovered and developed extensively for many years in technological and industrial process especially formation of titanium nitride (TiN) films due to its high hardness, good wear resistance, low friction coeffcient and chemical stability. These TiN films have been commonly used in microelectronics and coatings area. However, formation of TiN thin flms in nano size device using the plasma sometimes is not stable and hard to achived with optimum level. As a result, fundamental of understanding on the sputter mechanism of atom in reactive magnetron sputtering plasma is very important in order to implement the plasma sputtering for the formation of conformal TiN thin film in a very fine hole in integrated circuit device. In this work, the working power and nitrogen gas flow rate were varied during the deposition process and spectrocopic measurement. Plasma diagnostics such as optical emission spectrocopy and Langmuir probe were used for characterizing plasmas and for better understanding of physical and chemical processes occur during the deposition of TiN films in the plasma sputtering. On the other hand, the formation of TiN films using reactive magnetron sputtering system also have been conducted. The thickness and roughness of TiN films were examined using surface profiler and atomic force microscope respectively. Thus, correlation of relative depostion of TiN films and plasma diagnostics have been successfully obtained to improve the understanding of sputter mechansim process for TiN films. More quantitative analysis also had been done throughout the findings to confirm the effect of different parameters used significantly change the properties of TiN films. 2018-06 Thesis http://eprints.uthm.edu.my/245/ http://eprints.uthm.edu.my/245/1/24p%20SOO%20REH%20HOW.pdf text en public http://eprints.uthm.edu.my/245/2/SOO%20REH%20HOW%20COPYRIGHT%20DECLARATION.pdf text en staffonly http://eprints.uthm.edu.my/245/3/SOO%20REH%20HOW%20WATERMARK.pdf text en validuser mphil masters Universiti Tun Hussein Onn Malaysia Faculty of Electrical and Electronic Engineering
institution Universiti Tun Hussein Onn Malaysia
collection UTHM Institutional Repository
language English
English
English
topic TK7800-8360 Electronics
spellingShingle TK7800-8360 Electronics
Soo, Reh How
Investigation on plasma properties for deposition of titanium nitride film using reactive magnetron sputtering system
description Deposition of thin film using plasma sputtering system had been widely discovered and developed extensively for many years in technological and industrial process especially formation of titanium nitride (TiN) films due to its high hardness, good wear resistance, low friction coeffcient and chemical stability. These TiN films have been commonly used in microelectronics and coatings area. However, formation of TiN thin flms in nano size device using the plasma sometimes is not stable and hard to achived with optimum level. As a result, fundamental of understanding on the sputter mechanism of atom in reactive magnetron sputtering plasma is very important in order to implement the plasma sputtering for the formation of conformal TiN thin film in a very fine hole in integrated circuit device. In this work, the working power and nitrogen gas flow rate were varied during the deposition process and spectrocopic measurement. Plasma diagnostics such as optical emission spectrocopy and Langmuir probe were used for characterizing plasmas and for better understanding of physical and chemical processes occur during the deposition of TiN films in the plasma sputtering. On the other hand, the formation of TiN films using reactive magnetron sputtering system also have been conducted. The thickness and roughness of TiN films were examined using surface profiler and atomic force microscope respectively. Thus, correlation of relative depostion of TiN films and plasma diagnostics have been successfully obtained to improve the understanding of sputter mechansim process for TiN films. More quantitative analysis also had been done throughout the findings to confirm the effect of different parameters used significantly change the properties of TiN films.
format Thesis
qualification_name Master of Philosophy (M.Phil.)
qualification_level Master's degree
author Soo, Reh How
author_facet Soo, Reh How
author_sort Soo, Reh How
title Investigation on plasma properties for deposition of titanium nitride film using reactive magnetron sputtering system
title_short Investigation on plasma properties for deposition of titanium nitride film using reactive magnetron sputtering system
title_full Investigation on plasma properties for deposition of titanium nitride film using reactive magnetron sputtering system
title_fullStr Investigation on plasma properties for deposition of titanium nitride film using reactive magnetron sputtering system
title_full_unstemmed Investigation on plasma properties for deposition of titanium nitride film using reactive magnetron sputtering system
title_sort investigation on plasma properties for deposition of titanium nitride film using reactive magnetron sputtering system
granting_institution Universiti Tun Hussein Onn Malaysia
granting_department Faculty of Electrical and Electronic Engineering
publishDate 2018
url http://eprints.uthm.edu.my/245/1/24p%20SOO%20REH%20HOW.pdf
http://eprints.uthm.edu.my/245/2/SOO%20REH%20HOW%20COPYRIGHT%20DECLARATION.pdf
http://eprints.uthm.edu.my/245/3/SOO%20REH%20HOW%20WATERMARK.pdf
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