Mohammed Nwehil, A. (2018). The effect of shielding, grounding and bonding to the electromagnetic compatibility of high emission printed circuit board.
توثيق أسلوب شيكاغو (الطبعة السابعة عشر)Mohammed Nwehil, Aghssan. The Effect of Shielding, Grounding and Bonding to the Electromagnetic Compatibility of High Emission Printed Circuit Board. 2018.
توثيق جمعية اللغة المعاصرة MLA (الطبعة الثامنة)Mohammed Nwehil, Aghssan. The Effect of Shielding, Grounding and Bonding to the Electromagnetic Compatibility of High Emission Printed Circuit Board. 2018.
تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.