The effect of shielding, grounding and bonding to the electromagnetic compatibility of high emission printed circuit board

Electromagnetic Compatibility (EMC) is the capability of the device or the system to perform its work correctly within its electromagnetic environment without causing the introduction of electromagnetic damage to that environment. Radiated Emission (RE) is one of the EMC tests that should be conduct...

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Main Author:	Mohammed Nwehil, Aghssan
Format:	Thesis
Language:	English English
Published:	2018
Subjects:	TK7800-8360 Electronics
Online Access:	http://eprints.uthm.edu.my/429/1/24p%20AGHSSAN%20MOHAMMED%20NWEHIL.pdf http://eprints.uthm.edu.my/429/2/AGHSSAN%20MOHAMMED%20NWEHIL%20WATERMARK.pdf
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id	my-uthm-ep.429
record_format	uketd_dc
spelling	my-uthm-ep.4292021-07-25T06:19:59Z The effect of shielding, grounding and bonding to the electromagnetic compatibility of high emission printed circuit board 2018-07 Mohammed Nwehil, Aghssan TK7800-8360 Electronics Electromagnetic Compatibility (EMC) is the capability of the device or the system to perform its work correctly within its electromagnetic environment without causing the introduction of electromagnetic damage to that environment. Radiated Emission (RE) is one of the EMC tests that should be conducted to ensure that the product or equipment do not radiate any unwanted Electromagnetic (EM) to its environment. In this work, three different types of Printed Circuit Board (PCB) designs are studied. The PCBs are less costly and can be easily protected from the impact of the electromagnetic environment from the EM radiation. The effect of two high radiation circuits on each other has been studied and found to be the best way to reduce this bad effect using EMC techniques. Shielding is one of the EMC design to reduce the radiation. However, shielding must be accompanied by grounding to ensure unwanted current has been grounded to the shielded enclosure. Therefore the emission can be reduced an average 10.1 dB μV/m after grounding has been applied. The effect of two equipments without bonding can be useless because non-equipotential occurs. Therefore, bonding has been applied between two enclosures (system), which gave a significant reduction by 8.7 dB μV/m. Based on the study, it shows that the best bonding type is a metal plat joint tightly between two enclosures as compared with big tail wire or braided strap. 2018-07 Thesis http://eprints.uthm.edu.my/429/ http://eprints.uthm.edu.my/429/1/24p%20AGHSSAN%20MOHAMMED%20NWEHIL.pdf text en public http://eprints.uthm.edu.my/429/2/AGHSSAN%20MOHAMMED%20NWEHIL%20WATERMARK.pdf text en validuser mphil masters Universiti Tun Hussein Onn Malaysia Faculty of Electrical and Electronic Engineering
institution	Universiti Tun Hussein Onn Malaysia
collection	UTHM Institutional Repository
language	English English
topic	TK7800-8360 Electronics
spellingShingle	TK7800-8360 Electronics Mohammed Nwehil, Aghssan The effect of shielding, grounding and bonding to the electromagnetic compatibility of high emission printed circuit board
description	Electromagnetic Compatibility (EMC) is the capability of the device or the system to perform its work correctly within its electromagnetic environment without causing the introduction of electromagnetic damage to that environment. Radiated Emission (RE) is one of the EMC tests that should be conducted to ensure that the product or equipment do not radiate any unwanted Electromagnetic (EM) to its environment. In this work, three different types of Printed Circuit Board (PCB) designs are studied. The PCBs are less costly and can be easily protected from the impact of the electromagnetic environment from the EM radiation. The effect of two high radiation circuits on each other has been studied and found to be the best way to reduce this bad effect using EMC techniques. Shielding is one of the EMC design to reduce the radiation. However, shielding must be accompanied by grounding to ensure unwanted current has been grounded to the shielded enclosure. Therefore the emission can be reduced an average 10.1 dB μV/m after grounding has been applied. The effect of two equipments without bonding can be useless because non-equipotential occurs. Therefore, bonding has been applied between two enclosures (system), which gave a significant reduction by 8.7 dB μV/m. Based on the study, it shows that the best bonding type is a metal plat joint tightly between two enclosures as compared with big tail wire or braided strap.
format	Thesis
qualification_name	Master of Philosophy (M.Phil.)
qualification_level	Master's degree
author	Mohammed Nwehil, Aghssan
author_facet	Mohammed Nwehil, Aghssan
author_sort	Mohammed Nwehil, Aghssan
title	The effect of shielding, grounding and bonding to the electromagnetic compatibility of high emission printed circuit board
title_short	The effect of shielding, grounding and bonding to the electromagnetic compatibility of high emission printed circuit board
title_full	The effect of shielding, grounding and bonding to the electromagnetic compatibility of high emission printed circuit board
title_fullStr	The effect of shielding, grounding and bonding to the electromagnetic compatibility of high emission printed circuit board
title_full_unstemmed	The effect of shielding, grounding and bonding to the electromagnetic compatibility of high emission printed circuit board
title_sort	effect of shielding, grounding and bonding to the electromagnetic compatibility of high emission printed circuit board
granting_institution	Universiti Tun Hussein Onn Malaysia
granting_department	Faculty of Electrical and Electronic Engineering
publishDate	2018
url	http://eprints.uthm.edu.my/429/1/24p%20AGHSSAN%20MOHAMMED%20NWEHIL.pdf http://eprints.uthm.edu.my/429/2/AGHSSAN%20MOHAMMED%20NWEHIL%20WATERMARK.pdf
_version_	1747830607926263808

The effect of shielding, grounding and bonding to the electromagnetic compatibility of high emission printed circuit board

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