Interfacial reaction between SAC305 and SAC405 lead-free solders and electroless nickel/immersion silver (ENImAg) surface finish

Interfacial reaction between SAC305 and SAC405 lead-free solders and electroless nickel/immersion silver (ENImAg) surface finish

The different surface finish and solder size on printed circuit board strongly affect the formation of intermetallic compounds (IMCs) and solder joint reliability. Among of various surface finish in the electronic industry, electroless nickel/immersion gold is the most popular at the moment. Howe...

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Main Author: Mohamed Anuar, Rabiatul Adawiyah
Format: Thesis
Language:English
English
English
Published: 2017
Subjects:
TK7800-8360 Electronics
Online Access:http://eprints.uthm.edu.my/853/1/24p%20RABIATUL%20ADAWIYAH%20MOHAMED%20ANUAR.pdf
http://eprints.uthm.edu.my/853/2/RABIATUL%20ADAWIYAH%20MOHAMED%20ANUAR%20COPYRIGHT%20DECLARATION.pdf
http://eprints.uthm.edu.my/853/3/RABIATUL%20ADAWIYAH%20MOHAMED%20ANUAR%20WATERMARK.pdf
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spelling my-uthm-ep.8532021-09-06T05:39:43Z Interfacial reaction between SAC305 and SAC405 lead-free solders and electroless nickel/immersion silver (ENImAg) surface finish 2017-05 Mohamed Anuar, Rabiatul Adawiyah TK7800-8360 Electronics The different surface finish and solder size on printed circuit board strongly affect the formation of intermetallic compounds (IMCs) and solder joint reliability. Among of various surface finish in the electronic industry, electroless nickel/immersion gold is the most popular at the moment. However, because their black pad issues, electroless nickel/immersion silver (ENImAg) was developed as an alternative surface finish. Therefore, the effect on an interfacial reaction between lead-free solder and ENImAg surface finish using different solder ball size (Ø300μm, Ø500μm and Ø700μm) was investigated. All samples were subjected to an aging process with different aging times. The characterizations of IMC formation were examined by image analyzer, scanning electron microscopy and energy dispersive x-ray. The results showed that ENImAg finish was free from the black pad nickel. Subsequently, the solder ball size has a significant effect on the IMC formation and fracture surface of as-reflowed and aged solder joint. The IMC thickness of larger solder balls was found to be thicker (1.74 μm) than smaller solder balls (1.32 μm) during soldering. In contrast to aged solder joints, the smaller solder ball produced thicker (3.51 μm) IMC compared to bigger solder balls (2.47 μm). Furthermore, the fracture surface of smaller solder ball size showed ductile mode for both reflowed and aged solder joints. In addition, the solder joint on ENImAg surface finish displayed a thinner layer and smaller grain sizes compared to solder joint on bare copper. 2017-05 Thesis http://eprints.uthm.edu.my/853/ http://eprints.uthm.edu.my/853/1/24p%20RABIATUL%20ADAWIYAH%20MOHAMED%20ANUAR.pdf text en public http://eprints.uthm.edu.my/853/2/RABIATUL%20ADAWIYAH%20MOHAMED%20ANUAR%20COPYRIGHT%20DECLARATION.pdf text en staffonly http://eprints.uthm.edu.my/853/3/RABIATUL%20ADAWIYAH%20MOHAMED%20ANUAR%20WATERMARK.pdf text en validuser mphil masters Universiti Tun Hussein Onn Malaysia Fakulti Kejuruteraan Mekanikal dan Pembuatan
institution Universiti Tun Hussein Onn Malaysia
collection UTHM Institutional Repository
language English
English
English
topic TK7800-8360 Electronics
spellingShingle TK7800-8360 Electronics
Mohamed Anuar, Rabiatul Adawiyah
Interfacial reaction between SAC305 and SAC405 lead-free solders and electroless nickel/immersion silver (ENImAg) surface finish
description The different surface finish and solder size on printed circuit board strongly affect the formation of intermetallic compounds (IMCs) and solder joint reliability. Among of various surface finish in the electronic industry, electroless nickel/immersion gold is the most popular at the moment. However, because their black pad issues, electroless nickel/immersion silver (ENImAg) was developed as an alternative surface finish. Therefore, the effect on an interfacial reaction between lead-free solder and ENImAg surface finish using different solder ball size (Ø300μm, Ø500μm and Ø700μm) was investigated. All samples were subjected to an aging process with different aging times. The characterizations of IMC formation were examined by image analyzer, scanning electron microscopy and energy dispersive x-ray. The results showed that ENImAg finish was free from the black pad nickel. Subsequently, the solder ball size has a significant effect on the IMC formation and fracture surface of as-reflowed and aged solder joint. The IMC thickness of larger solder balls was found to be thicker (1.74 μm) than smaller solder balls (1.32 μm) during soldering. In contrast to aged solder joints, the smaller solder ball produced thicker (3.51 μm) IMC compared to bigger solder balls (2.47 μm). Furthermore, the fracture surface of smaller solder ball size showed ductile mode for both reflowed and aged solder joints. In addition, the solder joint on ENImAg surface finish displayed a thinner layer and smaller grain sizes compared to solder joint on bare copper.
format Thesis
qualification_name Master of Philosophy (M.Phil.)
qualification_level Master's degree
author Mohamed Anuar, Rabiatul Adawiyah
author_facet Mohamed Anuar, Rabiatul Adawiyah
author_sort Mohamed Anuar, Rabiatul Adawiyah
title Interfacial reaction between SAC305 and SAC405 lead-free solders and electroless nickel/immersion silver (ENImAg) surface finish
title_short Interfacial reaction between SAC305 and SAC405 lead-free solders and electroless nickel/immersion silver (ENImAg) surface finish
title_full Interfacial reaction between SAC305 and SAC405 lead-free solders and electroless nickel/immersion silver (ENImAg) surface finish
title_fullStr Interfacial reaction between SAC305 and SAC405 lead-free solders and electroless nickel/immersion silver (ENImAg) surface finish
title_full_unstemmed Interfacial reaction between SAC305 and SAC405 lead-free solders and electroless nickel/immersion silver (ENImAg) surface finish
title_sort interfacial reaction between sac305 and sac405 lead-free solders and electroless nickel/immersion silver (enimag) surface finish
granting_institution Universiti Tun Hussein Onn Malaysia
granting_department Fakulti Kejuruteraan Mekanikal dan Pembuatan
publishDate 2017
url http://eprints.uthm.edu.my/853/1/24p%20RABIATUL%20ADAWIYAH%20MOHAMED%20ANUAR.pdf
http://eprints.uthm.edu.my/853/2/RABIATUL%20ADAWIYAH%20MOHAMED%20ANUAR%20COPYRIGHT%20DECLARATION.pdf
http://eprints.uthm.edu.my/853/3/RABIATUL%20ADAWIYAH%20MOHAMED%20ANUAR%20WATERMARK.pdf
_version_ 1747830694195757056

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