Interfacial reactions during soldering of Sn-Ag-Cu lead free solders on immersion silver and electroless nickel/ immersion gold surface finishes
In the on-going trend towards miniaturization in the electronics packaging industry, the increasing popularity of ultra fine line technologies has brought into question the physical aspects of pad topography and metallization. As the solder joints shrink in size, the thickness of the pad metallizati...
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| Main Author: | |
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| Format: | Thesis |
| Language: | English |
| Published: |
2008
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| Online Access: | http://eprints.utm.my/id/eprint/10069/1/SitiRabiatullAishaMFKM2008.pdf |
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