Layout optimization and manning ratio improvement
The objective of this study is to design a new layout for space optimization and improve manning ratio . An ergonomic new peripheral for IC bonding machine s is also designed to obtain space savings. The study is limited to the IC bonding process of one product on a single production floor of the fa...
Saved in:
| Main Author: | |
|---|---|
| Format: | Thesis |
| Language: | English |
| Published: |
2010
|
| Subjects: | |
| Online Access: | http://eprints.utm.my/id/eprint/11237/1/YeongWengHarnMFKM2010.pdf |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Be the first to leave a comment!