Interfacial reactions between lead- free solders and electroless nickel/ immersion gold (ENIG) surface finish

The growth of advanced electronics has brought human to new eras which allow human to fully utilize the innovation of technology in daily applications. As semiconductor industry develops rapidly, flip chip based electronic packaging faces new challenges for packaging design and performance to meet f...

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Main Author:	Boo, Nan Shing
Format:	Thesis
Language:	English
Published:	2010
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://eprints.utm.my/id/eprint/12290/4/BooNanShingMFKM2010.pdf
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id	my-utm-ep.12290
record_format	uketd_dc
spelling	my-utm-ep.122902017-09-20T04:22:41Z Interfacial reactions between lead- free solders and electroless nickel/ immersion gold (ENIG) surface finish 2010-11 Boo, Nan Shing TJ Mechanical engineering and machinery The growth of advanced electronics has brought human to new eras which allow human to fully utilize the innovation of technology in daily applications. As semiconductor industry develops rapidly, flip chip based electronic packaging faces new challenges for packaging design and performance to meet far more stringent requirements on package size, quality, performance and reliability. This research has been made to study the effect of nickel additions on the interfacial reactions between Sn-3.0Ag-0.5Cu lead-free solder and electroless nickel (boron)/ immersion gold (ENIG) surface finish. The effect of isothermal ageing treatment on solder joints after reflow soldering, at temperatures of 150°C and 175°C for 250, 500 and 1000 hours, is also investigated. Several material characterization techniques including optical, scanning electron microscopy, energy dispersive x- ray analysis and image analysis were applied to investigate the intermetallic in terms of morphology, composition, thickness and distribution. From the study, it was observed that the IMC growth is influenced by ageing temperature and ageing duration where the thickness of intermetallic compounds increases with ageing. The result also showed that solder with Ni addition formed thinner IMC after reflow and ageing up to 1000 hours. The EDX analysis shows that the IMC formation and growth in the solder joints led to the formation of several types of IMC with different morphologies and chemical composition. 2010-11 Thesis http://eprints.utm.my/id/eprint/12290/ http://eprints.utm.my/id/eprint/12290/4/BooNanShingMFKM2010.pdf application/pdf en public masters Universiti Teknologi Malaysia, Faculty of Mechanical Engineering Faculty of Mechanical Engineering
institution	Universiti Teknologi Malaysia
collection	UTM Institutional Repository
language	English
topic	TJ Mechanical engineering and machinery
spellingShingle	TJ Mechanical engineering and machinery Boo, Nan Shing Interfacial reactions between lead- free solders and electroless nickel/ immersion gold (ENIG) surface finish
description	The growth of advanced electronics has brought human to new eras which allow human to fully utilize the innovation of technology in daily applications. As semiconductor industry develops rapidly, flip chip based electronic packaging faces new challenges for packaging design and performance to meet far more stringent requirements on package size, quality, performance and reliability. This research has been made to study the effect of nickel additions on the interfacial reactions between Sn-3.0Ag-0.5Cu lead-free solder and electroless nickel (boron)/ immersion gold (ENIG) surface finish. The effect of isothermal ageing treatment on solder joints after reflow soldering, at temperatures of 150°C and 175°C for 250, 500 and 1000 hours, is also investigated. Several material characterization techniques including optical, scanning electron microscopy, energy dispersive x- ray analysis and image analysis were applied to investigate the intermetallic in terms of morphology, composition, thickness and distribution. From the study, it was observed that the IMC growth is influenced by ageing temperature and ageing duration where the thickness of intermetallic compounds increases with ageing. The result also showed that solder with Ni addition formed thinner IMC after reflow and ageing up to 1000 hours. The EDX analysis shows that the IMC formation and growth in the solder joints led to the formation of several types of IMC with different morphologies and chemical composition.
format	Thesis
qualification_level	Master's degree
author	Boo, Nan Shing
author_facet	Boo, Nan Shing
author_sort	Boo, Nan Shing
title	Interfacial reactions between lead- free solders and electroless nickel/ immersion gold (ENIG) surface finish
title_short	Interfacial reactions between lead- free solders and electroless nickel/ immersion gold (ENIG) surface finish
title_full	Interfacial reactions between lead- free solders and electroless nickel/ immersion gold (ENIG) surface finish
title_fullStr	Interfacial reactions between lead- free solders and electroless nickel/ immersion gold (ENIG) surface finish
title_full_unstemmed	Interfacial reactions between lead- free solders and electroless nickel/ immersion gold (ENIG) surface finish
title_sort	interfacial reactions between lead- free solders and electroless nickel/ immersion gold (enig) surface finish
granting_institution	Universiti Teknologi Malaysia, Faculty of Mechanical Engineering
granting_department	Faculty of Mechanical Engineering
publishDate	2010
url	http://eprints.utm.my/id/eprint/12290/4/BooNanShingMFKM2010.pdf
_version_	1747814915528196096

Interfacial reactions between lead- free solders and electroless nickel/ immersion gold (ENIG) surface finish

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