Khalid, N. I. (2010). Adhesion on different rate of binder and aggregate for chip seal.
Chicago Style (17th ed.) CitationKhalid, Nor Ikhwan. Adhesion on Different Rate of Binder and Aggregate for Chip Seal. 2010.
MLA引文Khalid, Nor Ikhwan. Adhesion on Different Rate of Binder and Aggregate for Chip Seal. 2010.
警告：这些引文格式不一定是100％准确.