Intermetallic compound formation between Sn - 37Pb & Sn - Ag - Cu lead - free solders and immersion silver surface finish

Intermetallic compound formation between Sn - 37Pb & Sn - Ag - Cu lead - free solders and immersion silver surface finish

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Bibliographic Details
Main Author: Osman, Saliza Azlina
Format: Thesis
Published: 2008
Subjects:
TJ Mechanical engineering and machinery
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id my-utm-ep.18046
record_format uketd_dc
spelling my-utm-ep.180462017-07-02T07:03:13Z Intermetallic compound formation between Sn - 37Pb & Sn - Ag - Cu lead - free solders and immersion silver surface finish 2008-00 Osman, Saliza Azlina TJ Mechanical engineering and machinery 2008-00 Thesis http://eprints.utm.my/id/eprint/18046/ masters Universiti Teknologi Malaysia, Faculty of Mechanical Engineering Faculty of Mechanical Engineering
institution Universiti Teknologi Malaysia
collection UTM Institutional Repository
topic TJ Mechanical engineering and machinery
spellingShingle TJ Mechanical engineering and machinery
Osman, Saliza Azlina
Intermetallic compound formation between Sn - 37Pb & Sn - Ag - Cu lead - free solders and immersion silver surface finish
description
format Thesis
qualification_level Master's degree
author Osman, Saliza Azlina
author_facet Osman, Saliza Azlina
author_sort Osman, Saliza Azlina
title Intermetallic compound formation between Sn - 37Pb & Sn - Ag - Cu lead - free solders and immersion silver surface finish
title_short Intermetallic compound formation between Sn - 37Pb & Sn - Ag - Cu lead - free solders and immersion silver surface finish
title_full Intermetallic compound formation between Sn - 37Pb & Sn - Ag - Cu lead - free solders and immersion silver surface finish
title_fullStr Intermetallic compound formation between Sn - 37Pb & Sn - Ag - Cu lead - free solders and immersion silver surface finish
title_full_unstemmed Intermetallic compound formation between Sn - 37Pb & Sn - Ag - Cu lead - free solders and immersion silver surface finish
title_sort intermetallic compound formation between sn - 37pb & sn - ag - cu lead - free solders and immersion silver surface finish
granting_institution Universiti Teknologi Malaysia, Faculty of Mechanical Engineering
granting_department Faculty of Mechanical Engineering
publishDate 2008
_version_ 1747815179566972928

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