Effect of isothermal aging on the corrosion behavior of tin-lead and lead-free solders

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Main Author: Asri, Asma Kamarul
Format: Thesis
Published: 2011
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id my-utm-ep.26707
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spelling my-utm-ep.267072017-07-06T00:47:31Z Effect of isothermal aging on the corrosion behavior of tin-lead and lead-free solders 2011 Asri, Asma Kamarul TJ Mechanical engineering and machinery 2011 Thesis http://eprints.utm.my/id/eprint/26707/ http://libraryopac.utm.my/client/en_AU/main/search/results?qu=Effect+of+isothermal+aging+on+the+corrosion+behavior+of+tin-lead+and+lead-free+solders&te= masters Universiti Teknologi Malaysia, Faculty of Mechanical Engineering Faculty of Mechanical Engineering
institution Universiti Teknologi Malaysia
collection UTM Institutional Repository
topic TJ Mechanical engineering and machinery
spellingShingle TJ Mechanical engineering and machinery
Asri, Asma Kamarul
Effect of isothermal aging on the corrosion behavior of tin-lead and lead-free solders
description
format Thesis
qualification_level Master's degree
author Asri, Asma Kamarul
author_facet Asri, Asma Kamarul
author_sort Asri, Asma Kamarul
title Effect of isothermal aging on the corrosion behavior of tin-lead and lead-free solders
title_short Effect of isothermal aging on the corrosion behavior of tin-lead and lead-free solders
title_full Effect of isothermal aging on the corrosion behavior of tin-lead and lead-free solders
title_fullStr Effect of isothermal aging on the corrosion behavior of tin-lead and lead-free solders
title_full_unstemmed Effect of isothermal aging on the corrosion behavior of tin-lead and lead-free solders
title_sort effect of isothermal aging on the corrosion behavior of tin-lead and lead-free solders
granting_institution Universiti Teknologi Malaysia, Faculty of Mechanical Engineering
granting_department Faculty of Mechanical Engineering
publishDate 2011
_version_ 1747815491296034816