Effect of isothermal aging on the corrosion behavior of tin-lead and lead-free solders
Saved in:
Main Author: | Asri, Asma Kamarul |
---|---|
Format: | Thesis |
Published: |
2011
|
Subjects: | |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
-
Classical and damage mechanics-based models for lead-free solder interconnects
by: Lai, Zheng Bo
Published: (2009) -
Study of interfacial reactions between lead-free solders and immersion silver finish
by: Oshaghi, Safoura
Published: (2008) -
Temperature and strain-rate dependent damage-based models for lead-free solder interconnects
by: Mad Asasaari, Siti Faizah
Published: (2021) -
Interfacial reactions between lead- free solders and electroless nickel/ immersion gold (ENIG) surface finish
by: Boo, Nan Shing
Published: (2010) -
Study of interfacial reaction during reflow soldering of Sn-Ag-Cu lead-free solders on bare coppper and immersion silver surface finishes
by: Abu Hassan, Nurfazlin
Published: (2009)