Application of signal analysis techniques for condition monitoring of a wire-bonding machine
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| Format: | Thesis |
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2000
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my-utm-ep.28212 |
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my-utm-ep.282122012-10-04T10:37:54Z Application of signal analysis techniques for condition monitoring of a wire-bonding machine 2000-00 Ahmad, Putri Aidawati Unspecified 2000-00 Thesis http://eprints.utm.my/id/eprint/28212/ masters Universiti Teknologi Malaysia, Faculty of Electrical Engineering Faculty of Electrical Engineering |
| institution |
Universiti Teknologi Malaysia |
| collection |
UTM Institutional Repository |
| topic |
Unspecified |
| spellingShingle |
Unspecified Ahmad, Putri Aidawati Application of signal analysis techniques for condition monitoring of a wire-bonding machine |
| description |
|
| format |
Thesis |
| qualification_level |
Master's degree |
| author |
Ahmad, Putri Aidawati |
| author_facet |
Ahmad, Putri Aidawati |
| author_sort |
Ahmad, Putri Aidawati |
| title |
Application of signal analysis techniques for condition monitoring of a wire-bonding machine |
| title_short |
Application of signal analysis techniques for condition monitoring of a wire-bonding machine |
| title_full |
Application of signal analysis techniques for condition monitoring of a wire-bonding machine |
| title_fullStr |
Application of signal analysis techniques for condition monitoring of a wire-bonding machine |
| title_full_unstemmed |
Application of signal analysis techniques for condition monitoring of a wire-bonding machine |
| title_sort |
application of signal analysis techniques for condition monitoring of a wire-bonding machine |
| granting_institution |
Universiti Teknologi Malaysia, Faculty of Electrical Engineering |
| granting_department |
Faculty of Electrical Engineering |
| publishDate |
2000 |
| _version_ |
1747815598712160256 |