Interfacial reactions during soldering of lead-free solders on copper and nickel substrates
محفوظ في:
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| التنسيق: | أطروحة |
| منشور في: |
2012
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my-utm-ep.32195 |
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uketd_dc |
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my-utm-ep.321952013-06-12T07:54:32Z Interfacial reactions during soldering of lead-free solders on copper and nickel substrates 2012-00 Idris, Siti Rabiatull Aisha Unspecified 2012-00 Thesis http://eprints.utm.my/id/eprint/32195/ phd doctoral Universiti Teknologi Malaysia, Faculty of Mechanical Engineering Faculty of Mechanical Engineering |
| institution |
Universiti Teknologi Malaysia |
| collection |
UTM Institutional Repository |
| topic |
Unspecified |
| spellingShingle |
Unspecified Idris, Siti Rabiatull Aisha Interfacial reactions during soldering of lead-free solders on copper and nickel substrates |
| description |
|
| format |
Thesis |
| qualification_name |
Doctor of Philosophy (PhD.) |
| qualification_level |
Doctorate |
| author |
Idris, Siti Rabiatull Aisha |
| author_facet |
Idris, Siti Rabiatull Aisha |
| author_sort |
Idris, Siti Rabiatull Aisha |
| title |
Interfacial reactions during soldering of lead-free solders on copper and nickel substrates |
| title_short |
Interfacial reactions during soldering of lead-free solders on copper and nickel substrates |
| title_full |
Interfacial reactions during soldering of lead-free solders on copper and nickel substrates |
| title_fullStr |
Interfacial reactions during soldering of lead-free solders on copper and nickel substrates |
| title_full_unstemmed |
Interfacial reactions during soldering of lead-free solders on copper and nickel substrates |
| title_sort |
interfacial reactions during soldering of lead-free solders on copper and nickel substrates |
| granting_institution |
Universiti Teknologi Malaysia, Faculty of Mechanical Engineering |
| granting_department |
Faculty of Mechanical Engineering |
| publishDate |
2012 |
| _version_ |
1747815944533573632 |