Interfacial reactions during soldering of lead-free solders on copper and nickel substrates

مواد مشابهة

• Interfacial reactions during soldering of Sn-Ag-Cu lead free solders on immersion silver and electroless nickel/ immersion gold surface finishes
  بواسطة: Idris, Siti Rabiatull Aisha
  منشور في: (2008)
• Interfacial reactions between lead-free solders and electroless nickel
  بواسطة: Mohd. Muzamir Mahat,
  منشور في: (2009)
• Interfacial reactions between tin-silver-copper lead-free solders and nickel (P)/palladium/gold and nickel (B)/palladium/gold surface finishes
  بواسطة: Osman, Saliza Azlina
  منشور في: (2012)
• investigation of interfacial reactions between nickel substrates and solders /
  بواسطة: Liew, Siao Li
  منشور في: (2002)
• Interfacial Reactions And Electromigration In Lead-Free Solder Joints With Copper And Au-Ni Surface Finished Copper Substrates
  بواسطة: Binh, Duong Ngoc
  منشور في: (2009)