Experimental and finite element investigation of dynamic behavior of chassis-PCB assembly of electronic products

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Main Author: Jaswadi, Farizana
Format: Thesis
Published: 2009
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id my-utm-ep.3807
record_format uketd_dc
spelling my-utm-ep.38072014-01-02T04:18:02Z Experimental and finite element investigation of dynamic behavior of chassis-PCB assembly of electronic products 2009 Jaswadi, Farizana TJ Mechanical engineering and machinery Universiti Teknologi Malaysia 2009 Thesis http://eprints.utm.my/id/eprint/3807/ masters Universiti Teknologi Malaysia, Faculty of Mechanical Engineering Faculty of Mechanical Engineering
institution Universiti Teknologi Malaysia
collection UTM Institutional Repository
topic TJ Mechanical engineering and machinery
spellingShingle TJ Mechanical engineering and machinery
Jaswadi, Farizana
Experimental and finite element investigation of dynamic behavior of chassis-PCB assembly of electronic products
description
format Thesis
qualification_level Master's degree
author Jaswadi, Farizana
author_facet Jaswadi, Farizana
author_sort Jaswadi, Farizana
title Experimental and finite element investigation of dynamic behavior of chassis-PCB assembly of electronic products
title_short Experimental and finite element investigation of dynamic behavior of chassis-PCB assembly of electronic products
title_full Experimental and finite element investigation of dynamic behavior of chassis-PCB assembly of electronic products
title_fullStr Experimental and finite element investigation of dynamic behavior of chassis-PCB assembly of electronic products
title_full_unstemmed Experimental and finite element investigation of dynamic behavior of chassis-PCB assembly of electronic products
title_sort experimental and finite element investigation of dynamic behavior of chassis-pcb assembly of electronic products
granting_institution Universiti Teknologi Malaysia, Faculty of Mechanical Engineering
granting_department Faculty of Mechanical Engineering
publishDate 2009
_version_ 1747814473173827584