Experimental and finite element investigation of dynamic behavior of chassis-PCB assembly of electronic products
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2009
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my-utm-ep.38072014-01-02T04:18:02Z Experimental and finite element investigation of dynamic behavior of chassis-PCB assembly of electronic products 2009 Jaswadi, Farizana TJ Mechanical engineering and machinery Universiti Teknologi Malaysia 2009 Thesis http://eprints.utm.my/id/eprint/3807/ masters Universiti Teknologi Malaysia, Faculty of Mechanical Engineering Faculty of Mechanical Engineering |
institution |
Universiti Teknologi Malaysia |
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UTM Institutional Repository |
topic |
TJ Mechanical engineering and machinery |
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TJ Mechanical engineering and machinery Jaswadi, Farizana Experimental and finite element investigation of dynamic behavior of chassis-PCB assembly of electronic products |
description |
|
format |
Thesis |
qualification_level |
Master's degree |
author |
Jaswadi, Farizana |
author_facet |
Jaswadi, Farizana |
author_sort |
Jaswadi, Farizana |
title |
Experimental and finite element investigation of dynamic behavior of chassis-PCB assembly of electronic products
|
title_short |
Experimental and finite element investigation of dynamic behavior of chassis-PCB assembly of electronic products
|
title_full |
Experimental and finite element investigation of dynamic behavior of chassis-PCB assembly of electronic products
|
title_fullStr |
Experimental and finite element investigation of dynamic behavior of chassis-PCB assembly of electronic products
|
title_full_unstemmed |
Experimental and finite element investigation of dynamic behavior of chassis-PCB assembly of electronic products
|
title_sort |
experimental and finite element investigation of dynamic behavior of chassis-pcb assembly of electronic products |
granting_institution |
Universiti Teknologi Malaysia, Faculty of Mechanical Engineering |
granting_department |
Faculty of Mechanical Engineering |
publishDate |
2009 |
_version_ |
1747814473173827584 |