APA引文

Tai, S. F. (2003). Materials interaction during soldering and isothermal ageing of Sn-Pb and Sn-Ag-Cu solders on electroless Ni/Au surface finish.

Chicago Style (17th ed.) Citation

Tai, Siew Fong. Materials Interaction During Soldering and Isothermal Ageing of Sn-Pb and Sn-Ag-Cu Solders on Electroless Ni/Au Surface Finish. 2003.

MLA引文

Tai, Siew Fong. Materials Interaction During Soldering and Isothermal Ageing of Sn-Pb and Sn-Ag-Cu Solders on Electroless Ni/Au Surface Finish. 2003.

警告：这些引文格式不一定是100％准确.