Materials interaction during soldering and isothermal ageing of Sn-Pb and Sn-Ag-Cu solders on electroless Ni/Au surface finish

In flip chip interconnection an under bump metallurgy (UBM) is required to provide a diffusion barrier, an adhesion and a solderable surface. Among the various UBM systems available the electroless nickel / immersion gold (ENIG) has received greater attention in recent years due to its low cost and...

Full description

Saved in:

Bibliographic Details
Main Author:	Tai, Siew Fong
Format:	Thesis
Language:	English
Published:	2003
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://eprints.utm.my/id/eprint/4392/1/TaiSiewFongMFKM2003.pdf
Tags:	Add Tag No Tags, Be the first to tag this record!

id	my-utm-ep.4392
record_format	uketd_dc
spelling	my-utm-ep.43922018-01-28T05:53:25Z Materials interaction during soldering and isothermal ageing of Sn-Pb and Sn-Ag-Cu solders on electroless Ni/Au surface finish 2003-05 Tai, Siew Fong TJ Mechanical engineering and machinery In flip chip interconnection an under bump metallurgy (UBM) is required to provide a diffusion barrier, an adhesion and a solderable surface. Among the various UBM systems available the electroless nickel / immersion gold (ENIG) has received greater attention in recent years due to its low cost and because it does not require a mask. Most of the time, however, the electroless nickel layer contains phosphorus when hypophosphite is used as the reducing agent. In the present study, the effect of phosphorus content in the electroless nickel/immersion gold under bump metallurgy has been examined and the effect of isothermal aging at 150 OC for up to 500 hours on the formation and resultant morphology of the intermetallics formed between eutectic Pb-Sn solder and Sn-Ag-Cu lead-free solder and electroless Ni-P / immersion Au UBM has also been investigated. Structural examination and measurements of the average thickness of the growing intermetallic compounds on cross-sectioned solder joints made from the Sn-Ag-Cu solder revealed that the thickness of these intermetallic compounds increases as the phosphorus content in the electroless nickel decreases. On the other hand, in Pb-Sn eutectic solder the intermetallic compound thickness increases with increasing phosphorus content in the electroless nickel layer. Thermal ageing of the soldered joints led to the formation of several types of intermetallic compounds with different morphologies. 2003-05 Thesis http://eprints.utm.my/id/eprint/4392/ http://eprints.utm.my/id/eprint/4392/1/TaiSiewFongMFKM2003.pdf application/pdf en public masters Universiti Teknologi Malaysia, Faculty of Mechanical Engineering Faculty of Mechanical Engineering
institution	Universiti Teknologi Malaysia
collection	UTM Institutional Repository
language	English
topic	TJ Mechanical engineering and machinery
spellingShingle	TJ Mechanical engineering and machinery Tai, Siew Fong Materials interaction during soldering and isothermal ageing of Sn-Pb and Sn-Ag-Cu solders on electroless Ni/Au surface finish
description	In flip chip interconnection an under bump metallurgy (UBM) is required to provide a diffusion barrier, an adhesion and a solderable surface. Among the various UBM systems available the electroless nickel / immersion gold (ENIG) has received greater attention in recent years due to its low cost and because it does not require a mask. Most of the time, however, the electroless nickel layer contains phosphorus when hypophosphite is used as the reducing agent. In the present study, the effect of phosphorus content in the electroless nickel/immersion gold under bump metallurgy has been examined and the effect of isothermal aging at 150 OC for up to 500 hours on the formation and resultant morphology of the intermetallics formed between eutectic Pb-Sn solder and Sn-Ag-Cu lead-free solder and electroless Ni-P / immersion Au UBM has also been investigated. Structural examination and measurements of the average thickness of the growing intermetallic compounds on cross-sectioned solder joints made from the Sn-Ag-Cu solder revealed that the thickness of these intermetallic compounds increases as the phosphorus content in the electroless nickel decreases. On the other hand, in Pb-Sn eutectic solder the intermetallic compound thickness increases with increasing phosphorus content in the electroless nickel layer. Thermal ageing of the soldered joints led to the formation of several types of intermetallic compounds with different morphologies.
format	Thesis
qualification_level	Master's degree
author	Tai, Siew Fong
author_facet	Tai, Siew Fong
author_sort	Tai, Siew Fong
title	Materials interaction during soldering and isothermal ageing of Sn-Pb and Sn-Ag-Cu solders on electroless Ni/Au surface finish
title_short	Materials interaction during soldering and isothermal ageing of Sn-Pb and Sn-Ag-Cu solders on electroless Ni/Au surface finish
title_full	Materials interaction during soldering and isothermal ageing of Sn-Pb and Sn-Ag-Cu solders on electroless Ni/Au surface finish
title_fullStr	Materials interaction during soldering and isothermal ageing of Sn-Pb and Sn-Ag-Cu solders on electroless Ni/Au surface finish
title_full_unstemmed	Materials interaction during soldering and isothermal ageing of Sn-Pb and Sn-Ag-Cu solders on electroless Ni/Au surface finish
title_sort	materials interaction during soldering and isothermal ageing of sn-pb and sn-ag-cu solders on electroless ni/au surface finish
granting_institution	Universiti Teknologi Malaysia, Faculty of Mechanical Engineering
granting_department	Faculty of Mechanical Engineering
publishDate	2003
url	http://eprints.utm.my/id/eprint/4392/1/TaiSiewFongMFKM2003.pdf
_version_	1747814524341190656

Materials interaction during soldering and isothermal ageing of Sn-Pb and Sn-Ag-Cu solders on electroless Ni/Au surface finish

Similar Items