Materials interaction during soldering and isothermal ageing of Sn-Pb and Sn-Ag-Cu solders on electroless Ni/Au surface finish

In flip chip interconnection an under bump metallurgy (UBM) is required to provide a diffusion barrier, an adhesion and a solderable surface. Among the various UBM systems available the electroless nickel / immersion gold (ENIG) has received greater attention in recent years due to its low cost and...

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Bibliographic Details
Main Author: Tai, Siew Fong
Format: Thesis
Language:English
Published: 2003
Subjects:
Online Access:http://eprints.utm.my/id/eprint/4392/1/TaiSiewFongMFKM2003.pdf
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