Interfacial reactions between lead-free solders and electroless nickel

Interfacial reactions between lead-free solders and electroless nickel

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Bibliographic Details
Main Author: Mohd. Muzamir Mahat
Format: Thesis
Published: 2009
Subjects:
TK Electrical engineering
Electronics Nuclear engineering
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id my-utm-ep.48107
record_format uketd_dc
spelling my-utm-ep.481072015-10-15T01:09:48Z Interfacial reactions between lead-free solders and electroless nickel 2009 Mohd. Muzamir Mahat, TK Electrical engineering. Electronics Nuclear engineering 2009 Thesis http://eprints.utm.my/id/eprint/48107/ masters Universiti Teknologi Malaysia, Faculty of Mechanical Engineering Faculty of Mechanical Engineering
institution Universiti Teknologi Malaysia
collection UTM Institutional Repository
topic TK Electrical engineering
Electronics Nuclear engineering
spellingShingle TK Electrical engineering
Electronics Nuclear engineering
Mohd. Muzamir Mahat,
Interfacial reactions between lead-free solders and electroless nickel
description
format Thesis
qualification_level Master's degree
author Mohd. Muzamir Mahat,
author_facet Mohd. Muzamir Mahat,
author_sort Mohd. Muzamir Mahat,
title Interfacial reactions between lead-free solders and electroless nickel
title_short Interfacial reactions between lead-free solders and electroless nickel
title_full Interfacial reactions between lead-free solders and electroless nickel
title_fullStr Interfacial reactions between lead-free solders and electroless nickel
title_full_unstemmed Interfacial reactions between lead-free solders and electroless nickel
title_sort interfacial reactions between lead-free solders and electroless nickel
granting_institution Universiti Teknologi Malaysia, Faculty of Mechanical Engineering
granting_department Faculty of Mechanical Engineering
publishDate 2009
_version_ 1747817309435592704

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