Nickel phosphorus coated substrate micro-defect reduction through chemical mechanical planarization process optimization

Chemical mechanical planarization (CMP) was known as a process to gain superfine surface finish with high precision mechanical parameters. It widely used within semiconductors wafer manufacturing and hard disk (HDD) industries. There’re very few research done in HDD compared with silicon wafer. Micr...

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Bibliographic Details
Main Author: Mohd. Saleh, Nazim
Format: Thesis
Language:English
Published: 2014
Subjects:
Online Access:http://eprints.utm.my/id/eprint/50778/25/NazimMohdSalehMFKM2014.pdf
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