Nickel phosphorus coated substrate micro-defect reduction through chemical mechanical planarization process optimization
Chemical mechanical planarization (CMP) was known as a process to gain superfine surface finish with high precision mechanical parameters. It widely used within semiconductors wafer manufacturing and hard disk (HDD) industries. There’re very few research done in HDD compared with silicon wafer. Micr...
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| 主要作者: | |
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| 格式: | Thesis |
| 语言: | English |
| 出版: |
2014
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| 主题: | |
| 在线阅读: | http://eprints.utm.my/id/eprint/50778/25/NazimMohdSalehMFKM2014.pdf |
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