Optimisation Of Gravure Cylinder Plating By Designing And Fabricating The Cylinder Copper Plating Machine

The fast growing packaging industry in South-East Asia has provided a great potential for the use of cylinder copper plating machines for printing. The purpose of this project is to design and develop a prototype of an automated fully immersion cylinder copper plating machine capable of functioni...

Full description

Saved in:

Bibliographic Details
Main Author:	Ariyono, Sugeng
Format:	Thesis
Published:	2000
Subjects:	TJ Mechanical engineering and machinery
Tags:	Add Tag No Tags, Be the first to tag this record!

id	my-utm-ep.6928
record_format	uketd_dc
spelling	my-utm-ep.69282011-01-23T12:15:18Z Optimisation Of Gravure Cylinder Plating By Designing And Fabricating The Cylinder Copper Plating Machine 2000 Ariyono, Sugeng TJ Mechanical engineering and machinery The fast growing packaging industry in South-East Asia has provided a great potential for the use of cylinder copper plating machines for printing. The purpose of this project is to design and develop a prototype of an automated fully immersion cylinder copper plating machine capable of functioning at optimum parameters automatically and thus achive enhanced print quality. The development also includes minimising the set-up process and facilitates maintenance by designing leakage blocks and built-in module respectively. Complexity of the plating parameters needed in the gravure industry could have significant influence on the plating process and quality of end product. In this research work the effect of linear cylinder speed and cathode-anode distance on the copper plating efficiency, deposit structure, and hardness has been investigated. The results showed that maximum plating efficiency is affected by both cylinder linear speed and cathode-anode distance. Within the low range of linear speed covered (40 to 105 m/min), the maximum efficiency is achieved for small cathode-anode distance (2 cm). At high linear speeds (106 to 133 m/min), however, the maximum efficiency was observed to occur at higher cathode-anode distance (4 cm). This increase in efficinecy appears to be triggered by agitation in the electrolyte solution. Metallurgical examination revealed that the maximum plating efficiency is associated with finer structures and higher hardness valu 2000 Thesis http://eprints.utm.my/id/eprint/6928/ http://sps.utm.my masters Universiti Teknologi Malaysia, Mechanical Engineering Mechanical Engineering
institution	Universiti Teknologi Malaysia
collection	UTM Institutional Repository
topic	TJ Mechanical engineering and machinery
spellingShingle	TJ Mechanical engineering and machinery Ariyono, Sugeng Optimisation Of Gravure Cylinder Plating By Designing And Fabricating The Cylinder Copper Plating Machine
description	The fast growing packaging industry in South-East Asia has provided a great potential for the use of cylinder copper plating machines for printing. The purpose of this project is to design and develop a prototype of an automated fully immersion cylinder copper plating machine capable of functioning at optimum parameters automatically and thus achive enhanced print quality. The development also includes minimising the set-up process and facilitates maintenance by designing leakage blocks and built-in module respectively. Complexity of the plating parameters needed in the gravure industry could have significant influence on the plating process and quality of end product. In this research work the effect of linear cylinder speed and cathode-anode distance on the copper plating efficiency, deposit structure, and hardness has been investigated. The results showed that maximum plating efficiency is affected by both cylinder linear speed and cathode-anode distance. Within the low range of linear speed covered (40 to 105 m/min), the maximum efficiency is achieved for small cathode-anode distance (2 cm). At high linear speeds (106 to 133 m/min), however, the maximum efficiency was observed to occur at higher cathode-anode distance (4 cm). This increase in efficinecy appears to be triggered by agitation in the electrolyte solution. Metallurgical examination revealed that the maximum plating efficiency is associated with finer structures and higher hardness valu
format	Thesis
qualification_level	Master's degree
author	Ariyono, Sugeng
author_facet	Ariyono, Sugeng
author_sort	Ariyono, Sugeng
title	Optimisation Of Gravure Cylinder Plating By Designing And Fabricating The Cylinder Copper Plating Machine
title_short	Optimisation Of Gravure Cylinder Plating By Designing And Fabricating The Cylinder Copper Plating Machine
title_full	Optimisation Of Gravure Cylinder Plating By Designing And Fabricating The Cylinder Copper Plating Machine
title_fullStr	Optimisation Of Gravure Cylinder Plating By Designing And Fabricating The Cylinder Copper Plating Machine
title_full_unstemmed	Optimisation Of Gravure Cylinder Plating By Designing And Fabricating The Cylinder Copper Plating Machine
title_sort	optimisation of gravure cylinder plating by designing and fabricating the cylinder copper plating machine
granting_institution	Universiti Teknologi Malaysia, Mechanical Engineering
granting_department	Mechanical Engineering
publishDate	2000
_version_	1747814701830504448

Optimisation Of Gravure Cylinder Plating By Designing And Fabricating The Cylinder Copper Plating Machine

Similar Items