APA引文

Beh, K. S. (2004). Substrate Warpage analysis During Solger Reflow Process.

Chicago Style (17th ed.) Citation

Beh, Keh Shin. Substrate Warpage Analysis During Solger Reflow Process. 2004.

MLA引文

Beh, Keh Shin. Substrate Warpage Analysis During Solger Reflow Process. 2004.

警告：这些引文格式不一定是100％准确.